Luo et al., 2018 - Google Patents
Fabrication of solder balls via electromagnetic jettingLuo et al., 2018
- Document ID
- 14412243965396998287
- Author
- Luo Z
- Li Z
- Wang X
- Li W
- Publication year
- Publication venue
- 2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)
External Links
Snippet
Solder jetting is a growing technology for microelectronic packaging in diverse range of applications. In this paper, an electromagnetic jetting device is developed to direct deposit solder droplets. Experimental results show that the electromagnetic jetting is feasible to …
- 229910000679 solder 0 title abstract description 32
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