Lin et al., 2017 - Google Patents
Synergetic effect of Bi2Te3 alloys and electrodeposition of Ni for interfacial reactions at solder/Ni/Bi2Te3 jointsLin et al., 2017
- Document ID
- 14390244937847377820
- Author
- Lin C
- Hau N
- Huang Y
- Chang Y
- Feng S
- Chen C
- Publication year
- Publication venue
- Journal of Alloys and Compounds
External Links
Snippet
Ni is the most commonly used barrier in thermoelectric solder joints, and its role is to avoid excessive reaction between the bismuth telluride (Bi 2 Te 3) element and the Sn-based solder. This study, for the first time, demonstrates a strong effect of the Bi 2 Te 3 substrate on …
- 229910000679 solder 0 title abstract description 47
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L35/00—Thermo-electric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermo-electric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L35/12—Selection of the material for the legs of the junction
- H01L35/14—Selection of the material for the legs of the junction using inorganic compositions
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