Krieger et al., 2014 - Google Patents
Cohesive zone experiments for copper/mold compound delaminationKrieger et al., 2014
- Document ID
- 1427843557252204441
- Author
- Krieger W
- Raghavan S
- Kwatra A
- Sitaraman S
- Publication year
- Publication venue
- 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
External Links
Snippet
As complex multi-layered packaging becomes more common in microelectronic design, delamination remains a prominent failure mechanism due to coefficient of thermal expansion mismatch. Numerous studies have investigated interfacial cracking in …
- 230000032798 delamination 0 title abstract description 29
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/026—Specifications of the specimen
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0014—Type of force applied
- G01N2203/0016—Tensile or compressive
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/0202—Control of the test
- G01N2203/0212—Theories, calculations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/06—Indicating or recording means; Sensing means
- G01N2203/0617—Electrical or magnetic indicating, recording or sensing means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0058—Kind of property studied
- G01N2203/0092—Visco-elasticity, solidification, curing, cross-linking degree, vulcanisation or strength properties of semi-solid materials
- G01N2203/0094—Visco-elasticity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/022—Environment of the test
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/20—Investigating strength properties of solid materials by application of mechanical stress by applying steady bending forces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/40—Investigating hardness or rebound hardness
- G01N3/42—Investigating hardness or rebound hardness by performing impressions under a steady load by indentors, e.g. sphere, pyramid
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Tran et al. | Temperature, moisture and mode-mixity effects on copper leadframe/EMC interfacial fracture toughness | |
| van Driel et al. | Driving mechanisms of delamination related reliability problems in exposed pad packages | |
| Krieger et al. | Cohesive zone experiments for copper/mold compound delamination | |
| Dudek et al. | Reliability modelling for different wire bonding technologies based on FEA and nano-indentation | |
| Chiu et al. | A mechanics model for the moisture induced delamination in fan-out wafer-level package | |
| Rahangdale et al. | Mechanical characterization of RCC and FR4 laminated PCBs and assessment of their board level reliability | |
| Kwatra et al. | Effect of thermal aging on cohesive zone models to study copper leadframe/mold compound interfacial delamination | |
| Yeh et al. | Fracture Modeling and Characterization of Underfill/Polymer Interfacial Adhesion in RDL Interposer Package | |
| Albrecht et al. | Method for assessing the delamination risk in BEoL stacks around copper TSV applying nanoindentation and finite element simulation | |
| Khatibi et al. | Fatigue life time modelling of Cu and Au fine wires | |
| Xiao et al. | Interfacial fracture properties and failure modeling for microelectronics | |
| Otto et al. | Modelling the lifetime of heavy wire-bonds in power devices–concepts, limitations and challenges | |
| Liu et al. | The influence of molding compound properties on system-in-package reliability for 5G application | |
| Van Driel et al. | Prediction of delamination in micro-electronic packages | |
| Van Driel et al. | Characterization of interface strength as function of temperature and moisture conditions | |
| Pustan et al. | In situ analysis of the stress development during fabrication processes of micro-assemblies | |
| Schöngrundner et al. | Adhesion energy of printed circuit board materials using four-point-bending validated with finite element simulations | |
| Samet et al. | A compliance-based approach to study fatigue crack propagation for a copper-epoxy interface | |
| Xia et al. | Interfacial delamination and reliability design of exposed pad packages | |
| Yeh et al. | Analysis of Underfill-Polymer Interfacial Adhesive Strength by Combined Experimental and Modeling Approaches | |
| Pin et al. | Numerical study of thermomechanical fatigue influence of intermetallic compounds in a lead free solder joint | |
| Ernst et al. | Interface characterization and failure modeling for Semiconductor packages | |
| Jang et al. | Thermal Shock Life Prediction of the SiC Wide Bandgap Power Module Semiconductor Package Considering Creep Behavior of the Ag Sintered Interconnect and Viscoelastic Properties of the Epoxy Molding Compound | |
| Tao et al. | Investigation of Process-Induced Warpage of 3D-Stacked Memory Packaging | |
| Kniely et al. | Characterization and simulation of delamination on package-level considering sub-critical interfacial fracture-parameters under cyclic loading. |