Fiering et al., 2000 - Google Patents
High-density flexible interconnect for two-dimensional ultrasound arraysFiering et al., 2000
- Document ID
- 13524918694034386533
- Author
- Fiering J
- Hultman P
- Lee W
- Light E
- Smith S
- Publication year
- Publication venue
- IEEE transactions on ultrasonics, ferroelectrics, and frequency control
External Links
Snippet
We present a method for fabricating flexible multilayer circuits for interconnection to 2-D array ultrasound transducers. In addition, we describe four 2-D arrays in which such flexible interconnect is implemented, including transthoracic arrays with 438 channels operating at …
- 238000002604 ultrasonography 0 title abstract description 10
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezo-electric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezo-electric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezo-electric effect or with electrostriction using multiple elements on one surface
- B06B1/0629—Square array
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