Zhong, 2011 - Google Patents
Overview of wire bonding using copper wire or insulated wireZhong, 2011
View PDF- Document ID
- 13076550325026294292
- Author
- Zhong Z
- Publication year
- Publication venue
- Microelectronics Reliability
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Snippet
Wire bonding using copper or insulated wire leads to many advantages and new challenges. Research is intensively performed worldwide, leading to many new findings and solutions. This article reviews recent advances in wire bonding using copper wire or …
- 239000010949 copper 0 title abstract description 151
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2224/0554—External layer
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- H01L2224/4805—Shape
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- H01L2224/485—Material
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- H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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