Nothing Special   »   [go: up one dir, main page]

Kazim et al., 2012 - Google Patents

Analysis of 60 GHz flip-chipped package using EM tool-based time-domain reflectometry

Kazim et al., 2012

View PDF
Document ID
1268600267465291351
Author
Kazim M
Herben M
Publication year
Publication venue
2012 6th European Conference on Antennas and Propagation (EUCAP)

External Links

Snippet

A systematic approach based onpackage-peeling'together with time-domain reflectometry (TDR) for package characterization using an EM-tool is presented. The said methodology is applied to investigate and address the possible causes of transmission losses for a …
Continue reading at research.tue.nl (PDF) (other versions)

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01Q—AERIALS
    • H01Q9/00—Electrically-short aerials having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant aerials
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced with unbalanced lines or devices
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01Q—AERIALS
    • H01Q9/00—Electrically-short aerials having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant aerials
    • H01Q9/16—Resonant aerials with feed intermediate between the extremities of the aerial, e.g. centre-fed dipole
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01Q—AERIALS
    • H01Q1/00—Details of, or arrangements associated with, aerials
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01Q—AERIALS
    • H01Q21/00—Aerial arrays or systems
    • H01Q21/06—Arrays of individually energised active aerial units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/065—Patch antenna array

Similar Documents

Publication Publication Date Title
Jentzsch et al. Theory and measurements of flip-chip interconnects for frequencies up to 100 GHz
Jameson et al. A wide-band CMOS to waveguide transition at mm-wave frequencies with wire-bonds
US7566952B2 (en) On-chip circuit pad structure
Zhang et al. Tackling the issues of millimeter-wave on-chip antenna measurements
Liu et al. On-chip metal tiling for improving grounded mm-Wave antenna-on-chip performance in standard low-cost packaging
Li et al. Low-loss single-band, dual-band, and broadband mm-wave and (sub-) THz interconnects for THz SoP heterogeneous system integration
May et al. A 3 G-bit/s W-band SiGe ASK receiver with a high-efficiency on-chip electromagnetically-coupled antenna
Kazim et al. Analysis of 60 GHz flip-chipped package using EM tool-based time-domain reflectometry
CN109061534A (en) Corrector strip and the method that solid state microwave device test system is calibrated based on the corrector strip
Cuenca et al. Low-loss mm-wave transition from on-chip microstrip to rectangular waveguide
Jeong et al. A design of X-band 40 W pulse-driven GaN HEMT power amplifier
Adela et al. Bondwire impedance compensation using a series transmission line section
Namaki et al. An Extended L–2L De-Embedding Method for Modeling and Low Return-Loss Transition of Millimeter Wave Signal Through Silicon Interposer
Liu et al. Influence of on-wafer probes in mm-wave antenna measurements
Felic et al. Design of co-planar waveguide-fed slot/patch antenna with wire bond for a 60-GHz complementary metal-oxide-semiconductor transceiver
Aloui et al. Optimized pad design for millimeter-wave applications with a 65nm CMOS RF technology
Hirose et al. A flip-chip MMIC design with CPW technology in the W-band
Jafarlou et al. Wideband LTCC transitions of flip-chip to waveguides/connectors for a highly dense phased array system-in-package at 60 GHz
Ma et al. A 60GHz defected ground power divider using SiGe BiCMOS technology
Jogalekar et al. Slot Bow-Tie Antenna Integration in Flip-Chip and Embedded Die Enhanced QFN Package for WR8 and WR5 Frequency Bands
Wu et al. A low-cost DC-to-92 GHz broadband three-path bondwire interconnect
Akkermans et al. Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band
Riaz et al. Design and Experimental Evaluation of 60 GHz Self-compensating Bond-wire Interconnect
Jam et al. A micromachined packaging with incorporated RF-choke for integration of active chips at submillimeter-wave frequencies
Ahmad et al. Probing concept for an antenna array for 60 GHz band