Nothing Special   »   [go: up one dir, main page]

Tsai et al., 2007 - Google Patents

Testing and evaluation of silicon die strength

Tsai et al., 2007

View PDF
Document ID
11851875679823603173
Author
Tsai M
Lin C
Publication year
Publication venue
IEEE Transactions on Electronics Packaging Manufacturing

External Links

Snippet

In the applications of 3-D packages or stacked die packages, mostly the silicon wafers have to be ground thinner, and then the strengths of the dies from the wafers are needed for assuring good design and reliability of the packages. The purposes of this study are twofold …
Continue reading at www.researchgate.net (PDF) (other versions)

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02Details not specific for a particular testing method
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0058Kind of property studied

Similar Documents

Publication Publication Date Title
Tsai et al. Testing and evaluation of silicon die strength
Tsai et al. Investigation of thermomechanical behaviors of flip chip BGA packages during manufacturing process and thermal cycling
Wu et al. Fracture strength characterization and failure analysis of silicon dies
Yeung et al. An overview of experimental methodologies and their applications for die strength measurement
Hawkins et al. Measurement of silicon strength as affected by wafer back processing
Qian et al. Visco-elastic-plastic properties and constitutive modeling of underfills
Mercado et al. Evaluation of die edge cracking in flip-chip PBGA packages
Tsai et al. Evaluation of three-point bending strength of thin silicon die with a consideration of geometric nonlinearity
Tsai et al. Determination of silicon die strength
Merkle et al. Mechanical fatigue properties of heavy aluminium wire bonds for power applications
Tsai et al. Test methods for silicon die strength
Tsai et al. Geometric nonlinear effect on biaxial bending strength of thin silicon die in the PoEF test
Chen et al. Three-point bending strength and failure of window glass substrate by considering edge stress distribution
Wereszczak et al. Probabilistic strength of {1 1 1} n-type silicon
Samet et al. A compliance-based approach to study fatigue crack propagation for a copper-epoxy interface
Guojun et al. Characterization of silicon die strength with application to die crack analysis
Chao et al. Mechanical strength of thin Cu-TSV memory dies used in 3D IC packaging
Gourvest et al. Experimental and numerical study on silicon die strength and its impact on package reliability
Yeo et al. A novel damage test evaluation of IC bond pad stack strength
Huang et al. Nonlinearities in thin-silicon die strength tests
Tsai et al. Bending strength evaluation of Si interposers by PoEF test associated with acoustic emission method
Huang et al. Improved ball-on-elastic-pad and ball-on-hole tests for silicon die strength
Wu et al. Influence of grinding process on semiconductor chip strength
Liu et al. Mechanical Simulation and Characterization of Flexural Fracture of Stacked Die Memory Package
Gonzalez et al. Methodologies for Characterization of W2W Bonding Strength