Nothing Special   »   [go: up one dir, main page]

Yen et al., 2012 - Google Patents

Interfacial Reactions in Sn/Fe-x Ni Couples

Yen et al., 2012

Document ID
11258736792258908944
Author
Yen Y
Hsiao H
Lin S
Huang P
Lee C
Publication year
Publication venue
Journal of electronic materials

External Links

Snippet

The interfacial reactions between Sn and several Fe-x Ni alloys were investigated in this study. Two different FeSn 2 phase types formed at the Sn/Fe-40.8 at.% Ni (Sn/alloy 42) interface. When the Ni content of the Fe-Ni alloy was less than 80 at.%, only the FeSn 2 …
Continue reading at link.springer.com (other versions)

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3053—Fe as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C45/00—Amorphous alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making alloys

Similar Documents

Publication Publication Date Title
JP7135171B2 (en) solder composition
Kim et al. Interfacial reaction and die attach properties of Zn-Sn high-temperature solders
Ramli et al. Effect of TiO2 additions on Sn-0.7 Cu-0.05 Ni lead-free composite solder
Nishikawa et al. Interfacial reaction between Sn-0.7 Cu (-Ni) solder and Cu substrate
Bae et al. Microstructure and adhesion properties of Sn–0.7 Cu/Cu solder joints
Kim et al. Interfacial reactions of Si die attachment with Zn-Sn and Au-20Sn high temperature lead-free solders on Cu substrates
Choi et al. Interfacial microstructure and joint strength of Sn–3.5 Ag–X (X= Cu, In, Ni) solder joint
Chen et al. Effect of small additions of alloying elements on the properties of Sn-Zn eutectic alloy
Ma et al. A study on the physical properties and interfacial reactions with Cu substrate of rapidly solidified Sn-3.5 Ag lead-free solder
Song et al. Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering
Yen et al. Interfacial Reactions in Sn/Fe-x Ni Couples
Wang et al. Effects of minor amounts of Zn on the Sn-Zn/Ni interfacial reactions and phase equilibria of the ternary Sn-Zn-Ni system at 250° C
Yen et al. Interfacial reactions of Sn, Sn-3.0 Ag-0.5 Cu, and Sn-9Zn lead-free solders with Fe-42Ni substrates
Sun et al. Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni (P) immersion Au surface finish after reflow soldering
Zhao et al. Solder characteristics of a rapidly solidified Sn-9Zn-0.1 Cr alloy and mechanical properties of Cu/solder/Cu joints
Wang et al. Coupling effect of the interfacial reaction in Co/Sn/Cu diffusion couples
Yen et al. Effect of Cu addition on interfacial reaction between Sn–9Zn solder and Ag
Laksono et al. Interfacial reaction between Sn and Cu-Ti alloy (C1990HP)
Nishikawa et al. Interfacial reaction between Sn–Ag–Co solder and metals
Liou et al. Interfacial Reactions of Sn-9Zn-x Cu (x= 1, 4, 7, 10) Solders with Ni Substrates
Lin et al. Interfacial reactions in the Sn–20 at.% In/Cu and Sn–20 at.% In/Ni couples at 160 C
Qi et al. The effect of Bi on the IMC growth in Sn-3Ag-0.5 Cu solder interface during aging process
Yen et al. Study of Interfacial Reactions Between Lead-Free Solders and Cu-x Zn Alloys
Chang et al. Investigation of the interfacial reactions and mechanical strength in the Sn-Ag-Cu (SAC)/Cu-Be alloy (Alloy 25) couple
Yang et al. Saturation phenomenon of Ce and Ti in the modification of Al-Zn-Si filler metal