Steinhauser et al., 2020 - Google Patents
Plating on TOPCon as a way to reduce the fabrication costs of i-TOPCon solar cellsSteinhauser et al., 2020
View PDF- Document ID
- 10639044088046673916
- Author
- Steinhauser B
- Grübel B
- Nold S
- Arya V
- Schmiga C
- Kluska S
- Brand A
- Feldmann F
- Bay N
- Gay X
- Passig M
- Glatthaar M
- Publication year
- Publication venue
- 37th European PV Solar Energy Conference and Exhibition
External Links
Snippet
i-TOPCon solar cells commonly make use of a TOPCon/SiNx stack at the rear side. For screen-printed contacts, a certain TOPCon layer thickness in the range of 110 to 150 nm is usually required to prevent spiking of the contacts. In this publication, it is shown that laser …
- 238000007747 plating 0 title description 29
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