Nothing Special   »   [go: up one dir, main page]

Archambeault et al., 2013 - Google Patents

PCB design for real-world EMI control

Archambeault et al., 2013

Document ID
10553636086827455712
Author
Archambeault B
Drewniak J
Publication year

External Links

Snippet

Proper design of printed circuit boards can make the difference between a product passing emissions requirements during the first cycle or not. Traditional EMC design practices have been simply rule-based, that is, a list of rules-of-thumb are presented to the board designers …
Continue reading at books.google.com (other versions)

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50—Computer-aided design
    • G06F17/5009—Computer-aided design using simulation
    • G06F17/5036—Computer-aided design using simulation for analog modelling, e.g. for circuits, spice programme, direct methods, relaxation methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, and noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, and noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, and noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, and noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50—Computer-aided design
    • G06F17/5068—Physical circuit design, e.g. layout for integrated circuits or printed circuit boards
    • G06F17/5081—Layout analysis, e.g. layout verification, design rule check
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F1/00—Details of data-processing equipment not covered by groups G06F3/00 - G06F13/00, e.g. cooling, packaging or power supply specially adapted for computer application
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F2217/00—Indexing scheme relating to computer aided design [CAD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Similar Documents

Publication Publication Date Title
Archambeault et al. PCB design for real-world EMI control
Hall High-speed digital system design—A handbook of interconnect theory and design practices
Wu et al. Overview of signal integrity and EMC design technologies on PCB: Fundamentals and latest progress
Montrose EMC and the printed circuit board: design, theory, and layout made simple
Archambeault et al. Analysis of power/ground-plane EMI decoupling performance using the partial-element equivalent circuit technique
KR100294957B1 (en) Printed wiring board
Chen et al. Differential crosstalk mitigation in the pin field area of serdes channel with trace routing guidance
Dou et al. A passive PEEC-based micromodeling circuit for high-speed interconnection problems
Montrose EMC and printed circuit board design
Armstrong PCB design techniques for lowest-cost EMC compliance. Part 1
CN101389183A (en) Through-hole region design system and method for differential signal line
Erdin et al. Decoupling capacitor placement on resonant parallel-plates via driving point impedance
Weiler et al. High-speed layout guidelines
Terrell et al. Digital Design for Interference Specifications: A Practical Handbook for EMI Suppression
van Horck Electromagnetic compatibility and printed circuit boards
Lin et al. Novel design with minimized far-end crosstalk on single-ended striplines
Tran Electromagnetic Interference (EMI)
Singh et al. Drone Hardware Development
JP2008225962A (en) Electromagnetic failure noise analysis method and semiconductor integrated circuit
Huang A hybrid cavity and parallel-plate PEEC method for analysis of complex power net area fills, and a tool development for peak distortion analysis
Tang et al. EMC&EMI on High-Speed PCB Design
Yassin Physical Effects on the Worst-Case Delay Analysis and Signal Integrity of Buses and Spirals
Archambeault et al. EMC Fundamentals
Archambeault et al. The Ground Myth
Agarwal et al. Application of Signal Processing Techniques for Noise Reduction