Nothing Special   »   [go: up one dir, main page]

Zhao et al., 2015 - Google Patents

Effects of rare earth Ce addition on the microstructure, wettability and interfacial reactions of eutectic Sn–0.7 Cu solder

Zhao et al., 2015

Document ID
10483337022502599897
Author
Zhao N
Huang M
Zhong Y
Ma H
Pan X
Publication year
Publication venue
Journal of Materials Science: Materials in Electronics

External Links

Snippet

The effects of trace RE Ce addition on the microstructure, melting point and wettability of eutectic Sn–0.7 Cu solder as well as on the interfacial reactions of Sn–0.7 Cu–xCe/Cu (Ni) during soldering were investigated. The Ce bearing solders owned slightly higher melting …
Continue reading at link.springer.com (other versions)

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262Sn as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making alloys
    • C22C1/02Making alloys by melting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C45/00Amorphous alloys
    • C22C45/04Amorphous alloys with Ni or Co as the major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin

Similar Documents

Publication Publication Date Title
Gao et al. Effects of trace rare earth Nd addition on microstructure and properties of SnAgCu solder
Tu et al. Influence of Ce addition on Sn-3.0 Ag-0.5 Cu solder joints: thermal behavior, microstructure and mechanical properties
Zhang et al. Development of Sn–Zn lead-free solders bearing alloying elements
Wang et al. Effects of rare earth Ce on microstructures, solderability of Sn–Ag–Cu and Sn–Cu–Ni solders as well as mechanical properties of soldered joints
El-Daly et al. Improved creep resistance and thermal behavior of Ni-doped Sn–3.0 Ag–0.5 Cu lead-free solder
Hu et al. Effects of rare earth element Nd on the solderability and microstructure of Sn–Zn lead-free solder
Liu et al. Thermal property, wettability and interfacial characterization of novel Sn–Zn–Bi–In alloys as low-temperature lead-free solders
Shiue et al. Effect of La addition on the interfacial intermetallics and bonding strengths of Sn–58Bi solder joints with Au/Ni/Cu pads
Gao et al. Effect of nickel (Ni) on the growth rate of Cu 6 Sn 5 intermetallic compounds between Sn–Cu–Bi solder and Cu substrate
Jiang et al. Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder
Zhao et al. Effects of rare earth Ce addition on the microstructure, wettability and interfacial reactions of eutectic Sn–0.7 Cu solder
Wang et al. Microstructure, wetting property of Sn–Ag–Cu–Bi–x Ce solder and IMC growth at solder/Cu interface during thermal cycling
Torres et al. Effect of antimony additions on corrosion and mechanical properties of Sn-Bi eutectic lead-free solder alloy
Böyük et al. Effect of solidification parameters on the microstructure of Sn-3.7 Ag-0.9 Zn solder
Jing et al. Influence of rapid solidification on microstructure, thermodynamic characteristic and the mechanical properties of solder/Cu joints of Sn–9Zn alloy
Anderson et al. Observations of nucleation catalysis effects during solidification of SnAgCuX solder joints
Hu et al. Effects of In addition on the wettability, interfacial characterization and properties of ternary Sn–Cu–Ni solders
Takaku et al. Interfacial reaction and morphology between molten Sn base solders and Cu substrate
Zhao et al. Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys
Pu et al. Effects of Bi addition on the solderability and mechanical properties of Sn-Zn-Cu lead-free Solder
Lai et al. Effect of Ni addition to Sn0. 7Cu solder alloy on thermal behavior, microstructure, and mechanical properties
Wang et al. Comparative study on the wettability and interfacial structure in Sn–xZn/Cu and Sn/Cu–xZn system
Liu et al. Effects of Ag on the microstructure and shear strength of rapidly solidified Sn–58Bi solder
Fan et al. Effect of Ni content on the microstructure formation and properties of Sn-0.7 Cu-x Ni solder alloys
Nogita et al. Effects of phosphorus on microstructure and fluidity of Sn-0.7 Cu-0.05 Ni lead-free solder