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Suyama et al., 1987 - Google Patents

Electrical characteristics of MOSFET's utilizing Oxygen—Argon sputter-deposited gate Oxide films

Suyama et al., 1987

Document ID
9665374162109797562
Author
Suyama S
Okamoto A
Serikawa T
Publication year
Publication venue
IEEE transactions on electron devices

External Links

Snippet

This paper presents a detailed look at the electrical characteristics of MOSFET's utilizing oxygen-argon sputter-deposited gate-oxide films for low-temperature MOSFET fabrication. The gate-oxide films are deposited at low temperature (200° C) by oxygen-argon sputtering …
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    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in H01L21/20 - H01L21/268
    • H01L21/28008Making conductor-insulator-semiconductor electrodes
    • H01L21/28017Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28158Making the insulator
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