Nothing Special   »   [go: up one dir, main page]

Han et al., 2019 - Google Patents

Si microfluid cooler with jet-slot array for server processor direct liquid cooling

Han et al., 2019

View PDF
Document ID
9522139848517567089
Author
Han Y
Lau B
Tang G
Chen H
Zhang X
Publication year
Publication venue
IEEE Transactions on Components, Packaging and Manufacturing Technology

External Links

Snippet

With the rapid growth of information technology (IT), the requirement of higher computing performance results in a much higher power density in data center server. A Si microfluid cooler with jet-slot array has been developed for direct liquid cooling of a server processor in …
Continue reading at oar.a-star.edu.sg (PDF) (other versions)

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Similar Documents

Publication Publication Date Title
Han et al. Si microfluid cooler with jet-slot array for server processor direct liquid cooling
Zhang et al. Embedded cooling method with configurability and replaceability for multi-chip electronic devices
Drummond et al. Characterization of hierarchical manifold microchannel heat sink arrays under simultaneous background and hotspot heating conditions
Van Erp et al. Efficient microchannel cooling of multiple power devices with compact flow distribution for high power-density converters
Han et al. Enhancement of hotspot cooling with diamond heat spreader on Cu microchannel heat sink for GaN-on-Si device
Sharma et al. A novel method of energy efficient hotspot-targeted embedded liquid cooling for electronics: An experimental study
Sung et al. Single-phase hybrid micro-channel/micro-jet impingement cooling
Han et al. Thermal management of hotspots using diamond heat spreader on Si microcooler for GaN devices
CN101803019B (en) Integrated circuit stack and its thermal management
Zhang et al. Coupled electrical and thermal 3D IC centric microfluidic heat sink design and technology
Yang et al. Embedded microfluidic cooling with compact double H type manifold microchannels for large-area high-power chips
Han et al. Thermal management of hotspots with a microjet-based hybrid heat sink for GaN-on-Si devices
Han et al. Si-based hybrid microcooler with multiple drainage microtrenches for high heat flux cooling
Sung et al. Effects of jet pattern on single-phase cooling performance of hybrid micro-channel/micro-circular-jet-impingement thermal management scheme
Chen et al. Design, integration and performance analysis of a lid-integral microchannel cooling module for high-power chip
Shahi et al. assessment of reliability enhancement in high-power CPUs and GPUs using dynamic direct-to-chip liquid cooling
Yang et al. Local measurements of flow boiling heat transfer on hot spots in 3D compatible radial microchannels
TWI768936B (en) Liquid cooling device
Liu et al. Experimental research on a honeycomb microchannel cooling system
Tang et al. Development of a compact and efficient liquid cooling system with silicon microcooler for high-power microelectronic devices
Sabry et al. Thermal balancing of liquid-cooled 3D-MPSoCs using channel modulation
CN211319165U (en) Low flow resistance water-cooling chip radiator
Lien et al. An Energy-efficient Si-integrated Micro-cooler for High Power and Power-density Computing Applications
Zhang et al. Experimental investigation of the embedded micro-channel manifold cooling for power chips
Chuang et al. A Low Profile Two-phase Immersion Cooling Stack-up based on Detachable Boiling Enhancement Layer on Lidded Electronic Packages