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Pu et al., 2018 - Google Patents

An Ultra-low-power 28nm CMOS Dual-die ASIC platform for smart hearables

Pu et al., 2018

Document ID
9217321670880243607
Author
Pu Y
Butterfield D
Garcia J
Xie J
Lin M
Sauhta R
Farley R
Shellhammer S
Derkalousdian M
Newham A
Shi C
Shenoy R
Gousev E
Attar R
Publication year
Publication venue
2018 IEEE Biomedical circuits and systems conference (bioCAS)

External Links

Snippet

This paper presents an ultra-low-power dual-die platform for (medical) smart hearables. It pairs two custom ASICs: i) Blackghost-a 28nm CMOS near-threshold-V DD powered and highly integrated SoC with embedded PMU, MCU, 16-issue DSP engine and hardened …
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