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Ahmadnejad et al., 2013 - Google Patents

Design, analysis, and modelling of a MEMS capacitive microphone for integration into CMOS circuits

Ahmadnejad et al., 2013

Document ID
8773372916458881631
Author
Ahmadnejad J
Ganji B
Nemati A
Publication year
Publication venue
2013 IEEE Asia Pacific Conference on Postgraduate Research in Microelectronics and Electronics (PrimeAsia)

External Links

Snippet

A MEMS capacitive microphone with high mechanical sensitivity is presented. The microphone has a diaphragm thickness of 1 μm, 0.5× 0.5 mm 2 dimension, and an air gap of 1.0 μm. Using the results from analysis and simulation, important features of MEMS …
Continue reading at ieeexplore.ieee.org (other versions)

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01HMEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties, e.g. capacitance or reluctance
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/005Electrostatic transducers using semiconductor materials

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