Ahmadnejad et al., 2013 - Google Patents
Design, analysis, and modelling of a MEMS capacitive microphone for integration into CMOS circuitsAhmadnejad et al., 2013
- Document ID
- 8773372916458881631
- Author
- Ahmadnejad J
- Ganji B
- Nemati A
- Publication year
- Publication venue
- 2013 IEEE Asia Pacific Conference on Postgraduate Research in Microelectronics and Electronics (PrimeAsia)
External Links
Snippet
A MEMS capacitive microphone with high mechanical sensitivity is presented. The microphone has a diaphragm thickness of 1 μm, 0.5× 0.5 mm 2 dimension, and an air gap of 1.0 μm. Using the results from analysis and simulation, important features of MEMS …
- 238000004458 analytical method 0 title abstract description 5
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties, e.g. capacitance or reluctance
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
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