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Chang et al., 2018 - Google Patents

Encapsulated silver nanoparticles in water/oil emulsion for conductive inks

Chang et al., 2018

Document ID
8538642187754189189
Author
Chang C
Cheng T
Liao Y
Publication year
Publication venue
Journal of the Taiwan Institute of Chemical Engineers

External Links

Snippet

Silver nanoparticle (AgNP) inks are the most commonly used conductive ink for printed conductive tracks. However, the ink stability against aggregation and sedimentation is poor and results in short shelf life, severe nozzle clogging, and bad printing qualities. Herein, a …
Continue reading at www.sciencedirect.com (other versions)

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
    • B22F1/00—Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition
    • B22F1/0003—Metallic powders per se; Mixtures of metallic powders; Metallic powders mixed with a lubricating or binding agent
    • B22F1/0007—Metallic powder characterised by its shape or structure, e.g. fibre structure
    • B22F1/0011—Metallic powder characterised by size or surface area only
    • B22F1/0018—Nanometer sized particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; MISCELLANEOUS COMPOSITIONS; MISCELLANEOUS APPLICATIONS OF MATERIALS
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/32—Inkjet printing inks characterised by colouring agents
    • C09D11/322—Pigment inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the metallic pattern or other conductive pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles, i.e. inks which are sinterable at low temperatures

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