Liu et al., 2023 - Google Patents
Influences of composite additives and technological parameters on the microstructure and properties of electrolytic copper foilLiu et al., 2023
View PDF- Document ID
- 8260807076643891691
- Author
- Liu J
- Sun W
- Bai Z
- Liu E
- Cai H
- Zhang J
- Tian S
- Zhang C
- Xu Y
- Zhou M
- Zhang B
- Publication year
External Links
Snippet
In this paper, the additives consisting of bis-(3-sulfopropyl)-disulfide (SPS), hydroxyethylcellulose (HEC) and collagen additive compounding, are proposed to fabricate ultra-thin copper foils with low roughness on titanium substrates. The effect of the deposition …
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of work-pieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
- C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of work-pieces
- C25D5/54—Electroplating on non-metallic surfaces, e.g. on carbon or carbon composites
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Ünal et al. | Effects of ultrasonic agitation prior to deposition and additives in the bath on electrodeposited Ni-B/hBN composite coatings | |
| Chandrasekar et al. | Pulse and pulse reverse plating—Conceptual, advantages and applications | |
| Napłoszek-Bilnik et al. | Electrodeposition of composite Ni-based coatings with the addition of Ti or/and Al particles | |
| Li et al. | Ultrasonic-assisted electrodeposition of Ni-Cu/TiN composite coating from sulphate-citrate bath: Structural and electrochemical properties | |
| Thiemig et al. | Influence of pulse plating parameters on the electrocodeposition of matrix metal nanocomposites | |
| Sharma et al. | Influence of current density on microstructure of pulse electrodeposited tin coatings | |
| Sajjadnejad et al. | Textural and structural evolution of pulse electrodeposited Ni/diamond nanocomposite coatings | |
| Lin et al. | Annealing behavior of electrodeposited Ni-TiO2 composite coatings | |
| WO2007082112A2 (en) | Tin and tin alloy electroplating method with controlled internal stress and grain size of the resulting deposit | |
| Yu et al. | A novel strategy to electrodeposit high-quality copper foils using composite additive and pulse superimposed on direct current | |
| Mahdavi et al. | Effect of bath composition and pulse electrodeposition condition on characteristics and microhardness of cobalt coatings | |
| Zhou et al. | Al particles size effect on the microstructure of the co-deposited Ni–Al composite coatings | |
| Kim et al. | The effects of electroplating parameters on the composition and morphology of Sn-Ag solder | |
| Nam et al. | Synergistic effects of coumarin and cis-2-butene-1, 4-diol on high speed electrodeposition of nickel | |
| Zhang et al. | Influence of electrodeposition conditions on the microstructure and hardness of Ni-B/SiC nanocomposite coatings | |
| Bacal et al. | Electrodeposition of high-tungsten W-Ni-Cu alloys. Impact of copper on deposition process and coating structure | |
| Cesiulis et al. | Electrodeposition of CoMo and CoMoP alloys from the weakly acidic solutions | |
| Chandrasekar et al. | Structural and textural study of electrodeposited zinc from alkaline non-cyanide electrolyte | |
| Liu et al. | Influences of composite additives and technological parameters on the microstructure and properties of electrolytic copper foil | |
| Ding et al. | The electrodeposition of low-Sn imitation gold Cu–Sn alloy from EDTA-tartrate double complexing agents | |
| Mathur et al. | Effect of electrodeposition parameters on morphology of copper thin films | |
| Kamel et al. | Nickel electrodeposition from novel lactate bath | |
| Zhang et al. | Effects of pH on the Nickel coating microstructure and internal stress from an additive-free watts-type bath with phytic acid | |
| Hu et al. | Effect of current density and cobalt concentration on the characteristics of NiCo coatings prepared by electrodesposition with a supergravity field | |
| Feng et al. | Effect of ultrasonication on Ni–Mo coatings produced by DC electroformation |