Luu et al., 2008 - Google Patents
SEB characterization of commercial power MOSFETs with backside laser and heavy ions of different rangesLuu et al., 2008
View PDF- Document ID
- 7870039076289559443
- Author
- Luu A
- Miller F
- Poirot P
- Gaillard R
- Buard N
- Carriere T
- Austin P
- Bafleur M
- Sarrabayrouse G
- Publication year
- Publication venue
- IEEE Transactions on Nuclear Science
External Links
Snippet
SEB Characterization of Commercial Power MOSFETs With Backside Laser and Heavy Ions of
Different Ranges Page 1 2166 IEEE TRANSACTIONS ON NUCLEAR SCIENCE, VOL. 55, NO.
4, AUGUST 2008 SEB Characterization of Commercial Power MOSFETs With Backside Laser …
- 150000002500 ions 0 title abstract description 64
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/305—Contactless testing using electron beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Schwank et al. | Radiation hardness assurance testing of microelectronic devices and integrated circuits: Radiation environments, physical mechanisms, and foundations for hardness assurance | |
Titus | An updated perspective of single event gate rupture and single event burnout in power MOSFETs | |
Schwank et al. | Radiation hardness assurance testing of microelectronic devices and integrated circuits: Test guideline for proton and heavy ion single-event effects | |
Sexton | Destructive single-event effects in semiconductor devices and ICs | |
Ferlet-Cavrois et al. | Statistical analysis of the charge collected in SOI and bulk devices under heavy lon and proton irradiation—Implications for digital SETs | |
Johnston et al. | Latchup in CMOS from single particles | |
Luu et al. | SEB characterization of commercial power MOSFETs with backside laser and heavy ions of different ranges | |
Chumakov et al. | Local laser irradiation technique for SEE testing of ICs | |
Hales et al. | Experimental validation of an equivalent LET approach for correlating heavy-ion and laser-induced charge deposition | |
Musseau et al. | Laser probing of bipolar amplification in 0.25-/spl mu/m MOS/SOI transistors | |
Miller et al. | Characterization of single-event burnout in power MOSFET using backside laser testing | |
Richter et al. | Simulation of heavy charged particle tracks using focused laser beams | |
US9506970B2 (en) | Method for characterizing the sensitivity of electronic components to destructive mechanisms | |
Hooten et al. | The impact of depletion region potential modulation on ion-induced current transient response | |
Akturk et al. | Space and terrestrial radiation response of silicon carbide power MOSFETs | |
Shaneyfelt et al. | Total ionizing dose and single event effects hardness assurance qualification issues for microelectronics | |
Liu et al. | Recommended test conditions for SEB evaluation of planar power DMOSFETs | |
Ferlet-Cavrois et al. | Analysis of the transient response of high performance 50-nm partially depleted SOI transistors using a laser probing technique | |
Belyakov et al. | IC’s radiation effects modeling and estimation | |
Scheick | Testing guideline for single event gate rupture (SEGR) of power MOSFETs | |
Nikiforov et al. | Dose rate laser simulation tests adequacy: Shadowing and high intensity effects analysis | |
Lum et al. | New experimental findings for single-event gate rupture in MOS capacitors and linear devices | |
Novikov et al. | SEE laser testing at different temperatures | |
Miller et al. | Laser validation of a non-destructive test methodology for the radiation sensitivity assessment of power devices | |
Shu et al. | Observation of single event burnout (SEB) in an SOI NLDMOSFET using a pulsed laser |