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Zhou et al., 2003 - Google Patents

Three-dimensional kinematical analyses for surface grinding of large scale substrate

Zhou et al., 2003

Document ID
780857354575206782
Author
Zhou L
Shimizu J
Shinohara K
Eda H
Publication year
Publication venue
Precision Engineering

External Links

Snippet

Sponsored by New Energy and Industrial Technology Development Organization (NEDO) and the Ministry of Education, Science and Culture (MESC) of Japan, this project has developed an advanced machining system for∅ 300mm silicon wafer, using fixed abrasive …
Continue reading at www.sciencedirect.com (other versions)

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/25—Movable or adjustable work or tool supports

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