Nothing Special   »   [go: up one dir, main page]

Hebner, 1997 - Google Patents

Relative atomic chlorine density in inductively coupled chlorine plasmas

Hebner, 1997

Document ID
7534411435150624298
Author
Hebner G
Publication year
Publication venue
Journal of applied physics

External Links

Snippet

Atomic chlorine is an important chemical species in plasma processing of silicon and III–V compound semiconductors. Two-photon laser-induced fluorescence (LIF) has been used to measure the relative atomic chlorine density in an inductively driven, rf discharge in chlorine …
Continue reading at pubs.aip.org (other versions)

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers
    • H01L21/3105After-treatment
    • H01L21/311Etching the insulating layers by chemical or physical means
    • H01L21/31105Etching inorganic layers
    • H01L21/31111Etching inorganic layers by chemical means
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes, e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
    • H01J37/32917Plasma diagnostics
    • H01J37/32935Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32972Spectral analysis
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes, e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/62Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64Fluorescence; Phosphorescence
    • G01N21/6402Atomic fluorescence; Laser induced fluorescence
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01SDEVICES USING STIMULATED EMISSION
    • H01S3/00Lasers, i.e. devices for generation, amplification, modulation, demodulation, or frequency-changing, using stimulated emission, of infra-red, visible, or ultra-violet waves
    • H01S3/14Lasers, i.e. devices for generation, amplification, modulation, demodulation, or frequency-changing, using stimulated emission, of infra-red, visible, or ultra-violet waves characterised by the material used as the active medium
    • H01S3/22Gases
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/62Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/66Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light electrically excited, e.g. electroluminescence
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/62Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/71Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light thermally excited

Similar Documents

Publication Publication Date Title
Donnelly Plasma electron temperatures and electron energy distributions measured by trace rare gases optical emission spectroscopy
US5683538A (en) Control of etch selectivity
Hargis et al. Detection of CF2 radicals in a plasma etching reactor by laser‐induced fluorescence spectroscopy
US8237928B2 (en) Method and apparatus for identifying the chemical composition of a gas
Woodworth et al. Absolute intensities of the vacuum ultraviolet spectra in oxide etch plasma processing discharges
Ono et al. Measurements of the Cl atom concentration in radio‐frequency and microwave plasmas by two‐photon laser‐induced fluorescence: Relation to the etching of Si
Selwyn Spatially resolved detection of O atoms in etching plasmas by two‐photon laser‐induced fluorescence
Selwyn et al. Detection of Cl and chlorine‐containing negative ions in rf plasmas by two‐photon laser‐induced fluorescence
Hebner et al. Behavior of excited argon atoms in inductively driven plasmas
Hebner Relative atomic chlorine density in inductively coupled chlorine plasmas
Fleddermann et al. Negative ion densities in chlorine-and boron trichloride-containing inductively coupled plasmas
Cunge et al. Laser-induced fluorescence detection of as a primary product of Si and reactive ion etching with gas
Malyshev et al. Laser-induced fluorescence and Langmuir probe determination of Cl 2+ and Cl+ absolute densities in transformer-coupled chlorine plasmas
Tachibana et al. Vacuum-ultraviolet laser absorption spectroscopy for absolute measurement of fluorine atom density in fluorocarbon plasmas
Hioki et al. Diagnostics of an inductively coupled CF 4/Ar plasma
Booth et al. Fluorine negative ion density measurement in a dual frequency capacitive plasma etch reactor by cavity ring-down spectroscopy
Neuilly et al. Chlorine dissociation fraction in an inductively coupled plasma measured by ultraviolet absorption spectroscopy
Sasaki et al. Vacuum ultraviolet absorption spectroscopy for absolute density measurements of fluorine atoms in fluorocarbon plasmas
Malyshev et al. Diagnostics of inductively coupled chlorine plasmas: Measurement of Cl 2+ and Cl+ densities
Hebner et al. Metastable chlorine ion kinetics in inductively coupled plasmas
Hebner Metastable chlorine ion temperature and drift velocity in an inductively coupled plasma
Cunge et al. Absolute fluorine atom concentrations in fluorocarbon plasmas determined from CF 2 loss kinetics
Hebner et al. Relative atomic chlorine density in inductively coupled plasmas containing chlorine and boron trichloride
Kitajima et al. Influence of driving frequency on oxygen atom density in O2 radio frequency capacitively coupled plasma
Conner et al. Concentration profiles of CF in a CF4 radio frequency discharge via laser induced fluorescence and actinometry