Akben et al., 2020 - Google Patents
A comparative study of silver electrodeposition from pyrophosphate-cyanide and high concentration cyanide electrolytes in the presence of brightenersAkben et al., 2020
View PDF- Document ID
- 6926804112827039052
- Author
- Akben H
- Timur S
- Publication year
- Publication venue
- Turkish Journal of Chemistry
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Snippet
A study of the electrodeposition of silver from 2 different types of electrolytes;(1) neutral pyrophosphatecyanide electrolyte and (2) alkaline high concentrated cyanide electrolyte in the presence of a variety of additives such as 2-mercaptobenzothiazole, potassium …
- 239000003792 electrolyte 0 title abstract description 108
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- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver
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- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
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- C25D3/48—Electroplating: Baths therefor from solutions of gold
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- C23C18/31—Coating with metals
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- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
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- C25D3/00—Electroplating: Baths therefor
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- C25D3/46—Electroplating: Baths therefor from solutions of silver
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
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- C25D3/00—Electroplating: Baths therefor
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- C25D3/22—Electroplating: Baths therefor from solutions of zinc
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- C—CHEMISTRY; METALLURGY
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- C25D3/00—Electroplating: Baths therefor
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pre-treatment of the material to be coated
- C23C18/1803—Pre-treatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
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- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of work-pieces
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- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of work-pieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
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- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
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