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Wang et al., 2021 - Google Patents

Analytical Heat Transfer Model for a TTSVs-based Thermal Mitigation Power Chip

Wang et al., 2021

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Document ID
675580177766967373
Author
Wang Y
Yang F
Ma K
Publication year
Publication venue
Journal of Semiconductor Technology and Science

External Links

Snippet

The work develops an analytical thermal model for a thermal Through Silicon Vias based heat mitigation power chip whose thermal path is quite different compared to the literatures published. Thermal spreading angle and transverse heat transfer of thermal Through Silicon …
Continue reading at journal.auric.kr (PDF) (other versions)

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    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
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    • H01L2224/732—Location after the connecting process
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto

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