Wang et al., 2018 - Google Patents
Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layerWang et al., 2018
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- 633441868800723404
- Author
- Wang L
- Li J
- Catalano M
- Bai G
- Li N
- Dai J
- Wang X
- Zhang H
- Wang J
- Kim M
- Publication year
- Publication venue
- Composites Part A: Applied Science and Manufacturing
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Snippet
Diamond particles reinforced Cu matrix (Cu/diamond) composites were fabricated by gas pressure infiltration using Ti-coated diamond particles with Ti coating from 65 nm to 850 nm. The scanning transmission electron microscopy (STEM) characterizes that the Ti coating …
- 239000010432 diamond 0 title abstract description 176
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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