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Wang et al., 2018 - Google Patents

Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer

Wang et al., 2018

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Document ID
633441868800723404
Author
Wang L
Li J
Catalano M
Bai G
Li N
Dai J
Wang X
Zhang H
Wang J
Kim M
Publication year
Publication venue
Composites Part A: Applied Science and Manufacturing

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Diamond particles reinforced Cu matrix (Cu/diamond) composites were fabricated by gas pressure infiltration using Ti-coated diamond particles with Ti coating from 65 nm to 850 nm. The scanning transmission electron microscopy (STEM) characterizes that the Ti coating …
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    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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    • C01B31/02Preparation of carbon; Purification; After-treatment
    • C01B31/04Graphite, including modified graphite, e.g. graphitic oxides, intercalated graphite, expanded graphite or graphene
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    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
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