Nothing Special   »   [go: up one dir, main page]

Chen et al., 2021 - Google Patents

Direct on chip thermal measurement in IGBT modules using FBG technology—Sensing head interfacing

Chen et al., 2021

Document ID
6234457467343599587
Author
Chen S
Vilchis-Rodriguez D
Djurović S
Barnes M
Mckeever P
Jia C
Publication year
Publication venue
IEEE Sensors Journal

External Links

Snippet

This paper assesses the suitability of the use of Fiber Bragg Grating Sensors for effective in- situ sensing of the IGBT junction temperature. To this end, the optical sensor is installed on the chip surface in a commercial IGBT module, enabling direct reading of its junction …
Continue reading at ieeexplore.ieee.org (other versions)

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K17/00—Measuring quantity of heat
    • G01K17/06—Measuring quantity of heat conveyed by flowing mediums, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device
    • G01K17/08—Measuring quantity of heat conveyed by flowing mediums, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device based upon measurement of temperature difference or of a temperature
    • G01K17/20—Measuring quantity of heat conveyed by flowing mediums, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device based upon measurement of temperature difference or of a temperature across a radiating surface, combined with ascertainment of the heat transmission coefficient
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K11/00—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
    • G01K11/12—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using change of colour or translucency
    • G01K11/125—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using change of colour or translucency using change in reflectance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply, e.g. by thermoelectric elements
    • G01K7/42—Circuits for reducing thermal inertia; Circuits for predicting the stationary value of temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/005—Investigating or analyzing materials by the use of thermal means by investigating specific heat
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K3/00—Thermometers giving results other than momentary value of temperature
    • G01K3/08—Thermometers giving results other than momentary value of temperature giving differences of values; giving differentiated values

Similar Documents

Publication Publication Date Title
Chen et al. Direct on chip thermal measurement in IGBT modules using FBG technology—Sensing head interfacing
Mohammed et al. Distributed thermal monitoring of wind turbine power electronic modules using FBG sensing technology
Dos Reis et al. Strain gauges debonding fault detection for structural health monitoring
US7377689B2 (en) Transformer temperature monitoring and control
Badar et al. Real-time optical fiber-based distributed temperature monitoring of insulation oil-immersed commercial distribution power transformer
Mohammed et al. FBG thermal sensing features for hot spot monitoring in random wound electric machine coils
US20060251147A1 (en) Transformer temperature monitoring and control
US20110267598A1 (en) Optical sensor system and detecting method for an enclosed semiconductor device module
US20060045165A1 (en) Thermal interface material characterization system and method
Zaynetdinov et al. A fiber Bragg grating temperature sensor for 2–400 K
Chen et al. FBG head size influence on localized on-chip thermal measurement in IGBT power modules
Ren et al. Quasi-distributed temperature detection of press-pack IGBT power module using FBG sensing
Mohammed et al. FBG sensing for hot spot thermal monitoring in electric machinery random wound components
dos Santos et al. Datacenter thermal monitoring without blind spots: FBG-based quasi-distributed sensing
Chen et al. Direct On-Chip IGBT Thermal Sensing Using Adhesive Bonded FBG Sensors
Badar et al. Monitoring internal power transformer temperature using distributed optical fiber sensors
Lyon Jr et al. Relationship between current load and temperature for quasi-steady state and transient conditions
Chen et al. An apparatus for loss measurement of integrated power electronics modules: design and analysis
Vilchis-Rodriguez et al. IGBT finite element model for fibre bragg grating sensor installation analysis
GB2479942A (en) Optical sensor for power electronics module
CN103913253A (en) Device for packaging optical fiber grating temperature sensing probe on electric energy meter connecting terminal and integration temperature calibration method thereof
Lentzsch et al. Calibration methods and power cycling of double-side cooled SiC MOSFET power modules
Chen et al. A Comparison of Chip Temperature Acquisition Technologies of IGBT Power Modules
Mohammed et al. FBG array sensor use for distributed internal thermal monitoring in low voltage random wound coils
Wuest et al. Comparison of temperature sensitive electrical parameter based methods for junction temperature determination during accelerated aging of power electronics