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Shrivastava et al., 2022 - Google Patents

Predicting peak stresses in microstructured materials using convolutional encoder–decoder learning

Shrivastava et al., 2022

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Document ID
4704156332029340235
Author
Shrivastava A
Liu J
Dayal K
Noh H
Publication year
Publication venue
Mathematics and Mechanics of Solids

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Snippet

This work presents a machine-learning approach to predict peak-stress clusters in heterogeneous polycrystalline materials. Prior work on using machine learning in the context of mechanics has largely focused on predicting the effective response and overall …
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    • G06K9/00Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
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