Yokoyama et al., 2020 - Google Patents
Strong adhesion of polyvinylpyrrolidone-coated copper nanoparticles on various substrates fabricated from well-dispersed copper nanoparticle inksYokoyama et al., 2020
- Document ID
- 4486653206743889558
- Author
- Yokoyama S
- Nozaki J
- Motomiya K
- Tsukahara N
- Takahashi H
- Publication year
- Publication venue
- Colloids and Surfaces A: Physicochemical and Engineering Aspects
External Links
Snippet
In this study, we obtained copper nanoparticle (Cu NP) films exhibiting low resistivity and strong adhesion with respect to various substrates by drop-casting the Cu NP ink with polyvinylpyrrolidone (PVP) after being sintered at 250° C. PVP functioned as a dispersant in …
- 239000010949 copper 0 title abstract description 121
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Yokoyama et al. | Strong adhesion of polyvinylpyrrolidone-coated copper nanoparticles on various substrates fabricated from well-dispersed copper nanoparticle inks | |
Yabuki et al. | Low-temperature synthesis of copper conductive film by thermal decomposition of copper–amine complexes | |
Park et al. | Conductivity of silver paste prepared from nanoparticles | |
Mou et al. | Facile preparation of stable reactive silver ink for highly conductive and flexible electrodes | |
Secor et al. | Rapid and versatile photonic annealing of graphene inks for flexible printed electronics | |
Karthik et al. | Copper conductive inks: synthesis and utilization in flexible electronics | |
Zhao et al. | Conductivity enhancement of aerosol-jet printed electronics by using silver nanoparticles ink with carbon nanotubes | |
Lee et al. | Silver nanoplates as inkjet ink particles for metallization at a low baking temperature of 100 C | |
Yabuki et al. | Synthesis of copper conductive film by low-temperature thermal decomposition of copper–aminediol complexes under an air atmosphere | |
Paeng et al. | Laser-induced reductive sintering of nickel oxide nanoparticles under ambient conditions | |
Li et al. | Synthesis of stable ultra-small Cu nanoparticles for direct writing flexible electronics | |
Chen et al. | Using nanoparticles as direct-injection printing ink to fabricate conductive silver features on a transparent flexible PET substrate at room temperature | |
Le et al. | Fabrication of interdigitated electrodes by inkjet printing technology for apllication in ammonia sensing | |
Oh et al. | Silver-plated carbon nanotubes for silver/conducting polymer composites | |
Zhang et al. | Sintering mechanism of size-controllable Cu-Ag core–shell nanoparticles for flexible conductive film with high conductivity, antioxidation, and electrochemical migration resistance | |
Tang et al. | Thin, porous, and conductive networks of metal nanoparticles through electrochemical welding on a liquid metal template | |
Jun et al. | Synthesis and characterization of copper ink and direct printing of copper patterns by inkjet printing for electronic devices | |
Yoon et al. | Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions | |
Yokoyama et al. | Aqueous electrophoretic deposition of citric-acid-stabilized copper nanoparticles | |
Del Castillo-Castro et al. | Synthesis and characterization of metallic nanoparticles and their incorporation into electroconductive polymer composites | |
Zhan et al. | Silver frameworks based on self-sintering silver micro-flakes and its application in low temperature curing conductive pastes | |
Sreenilayam et al. | Additive-free silver nanoparticle ink development using flow-based Laser Ablation Synthesis in Solution and Aerosol Jet printing | |
Zhao et al. | Shape-driven arrest of coffee stain effect drives the fabrication of carbon-nanotube-graphene-oxide inks for printing embedded structures and temperature sensors | |
Nitta et al. | One-step gold line fabrication from particle-free inorganic salt-based ink via atmospheric pressure nonequilibrium plasma-assisted inkjet printing | |
Lefky et al. | Impact of solvent selection and temperature on porosity and resistance of printed self‐reducing silver inks |