Yu et al., 2008 - Google Patents
Production and properties of a spray formed 70% Si-Al alloy for electronic packaging applicationsYu et al., 2008
View PDF- Document ID
- 409382698716410079
- Author
- Yu K
- Li C
- Wang R
- Yang J
- Publication year
- Publication venue
- Materials transactions
External Links
Snippet
Modern electronics demands fast and efficient heat removal during the operation of the components. 1) Such heat dissipation is achieved by using heat sink and heat spreader packaging materials to prevent the failure of semiconductor devices. Ideal materials for the …
- 229910045601 alloy 0 title abstract description 61
Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1036—Alloys containing non-metals starting from a melt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
- B22D17/20—Accessories: Details
- B22D17/22—Dies; Die plates; Die supports; Cooling equipment for dies; Accessories for loosening and ejecting castings from dies
- B22D17/2209—Selection of die materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
- B22D17/007—Semi-solid pressure die casting
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