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Cell

[edit]
Name Image Cores Fab Transistors Die size L1 L2 Clock Package Introduced
XCPU 3× PPU 90 nm 165 M 168 mm2 I: 32 KB
D: 32 KB 		1024 KB  3.2 GHz xx pin FC-PBGA 2005
Cell/B.E. 1× PPU + 8× SPE 90 nm 234 M 235.5 mm2 I: 32 KB
D: 32 KB 		 512 KB  3.2 GHz xx pin FC-PBGA 2006
XCPU 3× PPU 65 nm 165 M xx mm2 I: 32 KB
D: 32 KB 		1024 KB  3.2 GHz xx pin FC-PBGA 2007
Cell/B.E. 1× PPU + 8× SPE 65 nm 234 M 174.6 mm2 I: 32 KB
D: 32 KB 		 512 KB  3.2 GHz xx pin FC-PBGA 2007
PowerXCell 8i 1× PPU + 8× eDP SPE 65 nm 250 M 109 mm2 I: 32 KB
D: 32 KB 		 512 KB  2.8-3.2 GHz xx pin FC-PBGA 2008
Cell/B.E. 1× PPU + 8× SPE 45 nm 234 M 115.5 mm2 I: 32 KB
D: 32 KB 		 512 KB  3.2 GHz xx pin FC-PBGA 2008
XCGPU 3× PPU + 1× GPU 45 nm 372 M 168 mm2 I: 32 KB
D: 32 KB 		 1024 KB  3.2 GHz xx pin FC-PBGA 2010
Name Image Cores Fab Transistors Die size L1 L2 Clock Package Introduced

POWER

[edit]
Name Image ISA Bits Cores Fab Transistors Die size L1 L2 L3 Clock Package Introduced
RIOS-1 POWER 32 bits 1 1.0 μm 6.9 M 1.284 mm2 8 KB I
64 KB D 		n/a n/a 20–30 MHz 10 chips
in CPGA
on PCB 		1990
RIOS.9 POWER 32 bits 1 1.0 μm 6.9 M 8 KB I
32 KB D 		n/a n/a 20–30 MHz 8 chips
in CPGA
on PCB 		1990
POWER1+ POWER 32 bits 1 6.9 M 8 KB I
64 KB D 		n/a n/a 25–41.6 MHz 8 chips
in CPGA
on PCB 		1991
POWER1++ POWER 32 bits 1 6.9 M 8 KB I
64 KB D 		n/a n/a 25–62.5 MHz 8 chips
in CPGA
on PCB 		1992
RSC POWER 32 bits 1 0.8 μm 1 M 226.5 mm2 8 KB
unified 		n/a n/a 33–45 MHz 201 pin CPGA 1992
POWER2 POWER2 32 bits 1 0.72 μm 23 M 1042.5 mm2
819 mm2 		32 KB I
128–265 KB D 		n/a n/a 55–71.5 MHz 6–8 dies
on ceramic 734 pin MCM 		1993
POWER2+ POWER2 32 bits 1 0.72 μm 23 M 819 mm2 32 KB I
64–128 KB D 		0.5–2 MB
external 		n/a 55–71.5 MHz 6 chips
in CBGA
on PCB 		1994
P2SC POWER2 32 bits 1 0.29 μm 15 M 335 mm2 32 KB I
128 KB D 		n/a n/a 120–135 MHz CCGA 1996
P2SC+ POWER2 32 bits 1 0.25 μm 15 M 256 mm2 32 KB I
128 KB D 		n/a n/a 160 MHz CCGA 1997
RAD6000 POWER 32 bits 1 0.5 μm 1.1 M 8 KB unified n/a n/a 20–33 MHz Rad hard 1997
POWER3 POWER2
PowerPC 1.1 		64 bits 1 0.35 μm 15 M 270 mm2 32 KB I
64 KB D 		1–16 MB
external 		n/a 200–222 MHz 1088 pin CLGA 1998
POWER3-II POWER2
PowerPC 1.1 		64 bits 1 0.25 μm Cu 23 M 170 mm2 32 KB I
64 KB D 		1–16 MB
external 		n/a 333–450 MHz 1088 pin CLGA 1999
POWER4 PowerPC 2.00
PowerPC-AS 		64 bits 2 180 nm 174 M 412 mm2 64 KB I
32 KB D
per core 		1.41 MB
per core 		32 MB
external 		1–1.3 GHz 1024 pin CLGA
ceramic MCM 		2001
POWER4+ PowerPC 2.01
PowerPC-AS 		64 bits 2 130 nm 184 M 267 mm2 64 KB I
32 KB D
per core 		1.41 MB
per chip 		32 MB
external 		1.2–1.9 GHz 1024 pin CLGA
ceramic MCM 		2002
POWER5 PowerPC 2.02
Power ISA 2.03 		64 bits 2 130 nm 276 M 389 mm2 32 KB I
32 KB D
per core 		1.875 MB
per chip 		32 MB
external 		1.5–1.9 GHz ceramic DCM
ceramic MCM 		2004
POWER5+ PowerPC 2.02
Power ISA 2.03 		64 bits 2 90 nm 276 M 243 mm2 32 KB I
32 KB D
per core 		1.875 MB
per chip 		32 MB
external 		1.5–2.3 GHz ceramic DCM
ceramic QCM
ceramic MCM 		2005
POWER6 Power ISA 2.03 64 bits 2 65 nm 790 M 341 mm2 64 KB I
64 KB D
per core 		4 MB
per core 		32 MB
external 		3.6–5 GHz CLGA
OLGA 		2007
POWER6+ Power ISA 2.03 64 bits 2 65 nm 790 M 341 mm2 64 KB I
64 KB D
per core 		4 MB
per core 		32 MB
external 		3.6–5 GHz CLGA
OLGA 		2009
POWER7 Power ISA 2.06 64 bits 4–8 45 nm 1.2 B 567 mm2 32 KB I
32 KB D
per core 		256 KB
per core 		32 MB
per chip 		2.4–4.25 GHz CLGA
OLGA
organic QCM 		2010
POWER7+ Power ISA 2.06 64 bits 3–8 32 nm 2.1 B 567 mm2 32 KB I
32 KB D
per core 		256 KB
per core 		80 MB
per chip 		2.4–4.4 GHz OLGA
organic DCM 		2012
POWER8 Power ISA 2.07 64 bits 12 22 nm ? 650 mm2 32 KB I
64 KB D
per core 		512 KB
per core 		96 MB
per chip 		4 GHz ? 2014?
Name Image ISA Bits Cores Fab Transistors Die size L1 L2 L3 Clock Package Introduced

RS64

[edit]
Name Codename Image Fab Transistors Die size L1 cache L2 cache Clock Package Introduced
A25
A35 		Muskie[1] 0.5 µm BiCMOS >25 M six chips I: 8 kB
D: 256 kB 		n/a 154 MHz
182 MHz 		7 chip MCM 1995
1996
A10 Cobra 0.5 µm CMOS 4.7 M 213 mm2 I: 4kB
D: 8 kB 		1 MB off die 50-77 MHz 625 pin CBGA 1995
RS64 Apache 0.5 µm BiCMOS transistors size 128 kB 4 MB off die 125 MHz CBGA 1997
RS64-II
A50 		Northstar 0.35 µm 12.5 M 162 mm2 I: 64 kB
D: 64 kB 		2-32 MB off die 262 MHz CBGA 1998
RS64-III Pulsar 0.22 µm Cu 34 M 140 mm2 I: 128 kB
D: 128 kB 		2-8 MB off die 450 MHz CBGA 1999
RS64-III IStar image 0.22 µm Cu SOI 34 M 140 mm2 I: 128 kB
D: 128 kB 		2-8 MB off die 400-600 MHz CBGA 2000
RS64-IV SStar 0.18 µm Cu SOI 44 M 128 mm2 I: 128 kB
D: 128 kB 		2-16 MB off die 600-750 MHz CBGA 2001

PowerPC 600

[edit]
Name Manufacturer Image Fab Transistors Die size L1 cache Clock Package Introduced
PPC601
MPC601 		IBM 0.65 µm 2.8 M 121 mm2 32 kB unified 50-80 MHz 304 pin CQFP 1993
PPC601v IBM 0.5 µm 2.8 M 74 mm2 32 kB unified 90-120 MHz 304 pin CQFP 1994
PPC602
MPC602 		IBM
Motorola 		image 0.5 µm 1 M 50 mm2 4 kB / 4 kB 50-80 MHz 144 pin PQFP 1995
PPC603
MPC603 		IBM
Motorola 		0.5 µm 1.6 M 85 mm2 8 kB / 8 kB 50-75 MHz 240 pin CQFP
255 CBGA 		1995
PPC604
MPC604 		IBM
Motorola 		image 0.5 µm 3.6 M 196 mm2 16 kB / 16 kB 100-180 MHz 304 pin CQFP
255 pin CBGA 		1995
PPC603e
MPC603e 		IBM
Motorola 		image 0.5 µm 2.6 M 98 mm2 16 kB / 16 kB 100-200 MHz 240 pin CQFP
255 pin CBGA 		1996
PPC604e
MPC604e 		IBM
Motorola 		0.35 µm 5.1 M 148 mm2 32 kB / 32 kB 166-233 MHz 256 pin CBGA 1996
PPC603ev
MPC603ev 		IBM
Motorola 		0.35 µm 2.6 M 78 mm2 16 kB / 16 kB 100-300 MHz 255 pin CBGA
255 pin PBGA 		1997
PPC604ev
MPC604r 		IBM
Motorola 		image 0.25 µm 5.1 M 47 mm2 32 kB / 32 kB 250-400 MHz 255 pin CBGA 1997
PPC620
MPC620 		IBM
Motorola 		image 0.5 µm 6.9 M 311 mm2 32 kB / 32 kB 120-150 MHz 625 pin CBGA 1997

PowerPC 970

[edit]
Name Model #. Image Fab Transistors Die size Cores Clock L2 cache Package Introduced
PowerPC 970 1RK111b 130 nm SOI 52 M 121 mm2 1 1.6 - 2.0 GHz 512 kB  576 pin CBGA 2003
PowerPC 970FX 66P7842
32R8131 (Low lead) 		90 nm SOI 52 M 66.2 mm2 1 1 - 2.5 GHz 512 kB 576 pin CBGA 2004
PowerPC 970MP 32R8213 90 nm SOI 183 M 155.1 mm2 2 1.2 - 2.5 GHz 2× 1024 kB 575 pin CBGA 2005
PowerPC 970GX n/a 90 nm SOI ~90 M 77.6 mm2 1 1.2 - 3.0 GHz 1024 kB 575 pin CBGA n/a

PowerPC 750

[edit]
Name Manufacturer Image Fab Transistors Die size Cores Clock L2 cache Package Introduced
PPC750
MPC750 		IBM
Motorola 		0.25 μm Al 6.35 M 67 mm2 1 233 - 366 MHz 256 - 1024 kB
off die 		360 pin CBGA 1997
PPC740
MPC740 		IBM
Motorola 		0.25 μm Al 6.35 M 67 mm2 1 233 - 366 MHz n/a 255 pin CBGA 1997
MPC755 Motorola
Freescale 		0.22 μm Al 6.75 M 51 mm2 1 300 - 400 MHz 256 - 1024 kB
off die 		360 pin PBGA
360 pin CBGA 		1998
MPC745 Motorola
Freescale 		0.22 μm Al 6.75 M 51 mm2 1 300 - 350 MHz n/a 255 pin PBGA 1998
PPC750L IBM 0.20 μm Cu 6.35 M 40 mm2 1 300 - 500 MHz 256 - 1024 kB
off die 		360 pin CBGA 1999
PPC740L IBM 0.20 μm Cu 6.35 M 40 mm2 1 300 - 500 MHz n/a 255 pin CBGA 1999
PPC750CX
PPC750CXe
PPC750CXr
Gekko 		IBM 0.18 μm Cu 20 M 43 mm2 1 300 - 500 MH
400 - 700 MHz
300 - 533 MHz
485 MHz 		256 kB 256 pin PBGA 2000
2001
2003
2001
RAD750 BAE Systems 0.15 μm 10.4 M 130 mm2 1 110 - 200 MHz 0 - 1024 kB
off die 		360 pin CBGA
Radiation hardened 		2001
PPC750FX
PPC750FL 		IBM 0.13 μm SOI 38 M 34.3 mm2 1 600 - 900 MHz
600 - 733 MHz 		512 kB 292 pin CBGA 2002
2007
PPC750GX
PPC750GL 		IBM 0.13 μm SOI 74 M 52.5 mm2 1 733 - 1000 MHz
800 - 933 MHz 		1024 kB 292 pin CBGA 2003
2005
PPC750CL
Broadway 		IBM 90 nm SOI 20 M 15.9 mm2 1 400 - 1000 MHz
729 MHz 		256 kB 278 pin PBGA 2006
Espresso IBM 45 nm SOI 27.7mm2 3 1243 MHz 0.5+2+0.5 MB PBGA MCM 2012

PowerPC 7400 / e600 core

[edit]
Name Image Fab Transistors Die size Cores Clock L2 cache L3 cache Package Introduced
MPC7400 0.20 μm 10.5 M 83 mm2 1 350 - 500 MHz 512 - 2048 kB
off die 		n/a 360 pin CBGA 1999
MPC7410 0.18 μm 10.5 M 52 mm2 1 400 - 550 MHz 512 - 2048 kB
off die 		n/a 360 pin CBGA
360 pin CLGA 		2001
MPC7450
MPC7451 		0.18 μm 33 M 106 mm2 1 500 - 867 MHz  256 kB 0 - 2 MB
off die 		483 pin CBGA 2001
MPC7440
MPC7441 		0.18 μm 33 M 106 mm2 1 500 - 800 MHz  256 kB n/a 360 CBGA 2001
MPC7455 0.18 μm SOI 33 M 106 mm2 1 600 - 1420 MHz  256 kB 0 - 2 MB
off die 		483 pin CBGA 2002
MPC7445 0.18 μm SOI 33 M 106 mm2 1 600 - 1420 MHz  256 kB 0 - 2 MB
off die 		360 pin CBGA 2002
MPC7457 0.13 μm SOI 58 M 98.3 mm2 1 867 - 1267 MHz  512 kB 0 - 4 MB
off die 		483 pin CBGA 2003
MPC7447
MPC7447/A 		0.13 μm SOI 48.6 M 83.9 mm2 1 600 - 1420 MHz
600 - 1500 MHz 		 512 kB n/a 360 pin CBGA
360 pin CLGA 		2003
2004
MPC7448 90 nm SOI 90 M 58.44 mm2 1 1000 - 1700 MHz  1024 kB n/a 360 pin CBGA
360pin CLGA 		2005
MPC8641D
MPC8641 		90 nm SOI 225 M 177.87 mm2 2
1 		1000 - 1500 MHz 2× 1024 kB
1× 1024 kB 		n/a 1023 pin CBGA 2007
MPC8610 90 nm SOI 82.45 mm2 1 667 - 1333 MHz 256 kB n/a 783 pin PBGA 2008
MPC8640D
MPC8640 		90 nm SOI 225 M 177.87 mm2 2
1 		1000 - 1250 MHz 2× 1024 kB
1× 1024 kB 		n/a 1023 pin CBGA 2008
  1. ^ Fortress Rochester: The Inside Story of the IBM Iseries
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