Article

Thermal-ADI: a linear-time chip-level dynamic thermal simulation algorithm based on alternating-direction-implicit (ADI) method

Authors:

Ting-Yuan Wang,

Charlie Chung-Ping ChenAuthors Info & Claims

ISPD '01: Proceedings of the 2001 international symposium on Physical design

Pages 238 - 243

https://doi.org/10.1145/369691.369794

Published: 01 April 2001 Publication History

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Abstract

Due to the dramatic increase of clock frequency and integration density, power density and on-chip temperature in high-end VLSI circuits rise significantly. To ensure the timing correctness and the reliability of high-end VLSI design, efficient and accurate chip-level transient thermal simulations are of crucial importance.

In this paper, we develop and present an efficient transient thermal simulation algorithm based on the alternating-direction-implicit method. Our algorithm, Thermal-ADI, not only hasa linear runtime and memory requirement, but also isunconditionally stablewhich ensures that time-step is not limited by any stability requirement. Extensive experimental results show that our algorithm is not only orders of magnitude faster than the traditional thermal simulation algorithms but also highly accurate, and efficient in memory usage.

References

[1]

M. Necati Ozisik,"Boundary Value Problems of Heat Conduction,"Dover Publications Inc. 1968.

Google Scholar

[2]

M. Necati Ozisik,"Finite Difference Methods in Heat Transfer," CRC Press 1994.

Google Scholar

[3]

Yi-Kan Cheng, Prasun Raha, Chin-Chi Teng, Elyse Rosenbaum, and Sung-Mo Kang," ILLIADS-T: An Electrothermal Timing Simulator for Temperature-Sensitive Reliability Diagnosis of CMOS VLSI Chips "IEEE Trans. Computer-Aided Design pp 668-681, Vol.17, No.8, Aug.1998.

Digital Library

Google Scholar

[4]

Li-Pen Yuan, Chih-Chi Teng, and Sung-Mo Kang, "Statistical Estimation of Average Power Dissipation " DAC97 34th Design Automation Conference 1997

Digital Library

Google Scholar

[5]

Chih-Chi Teng, Yi-Kan Cheng, Elyse Rosenbaum, and Sung-Mo Kang," iTEM: A Temperature-Dependent Electromigration Reliability Diagnosis Tool "IEEE Trans. Computer-Aided Design of Integrated Circuit and Systems pp 882-893, Vol. 16, No. 8, Aug.1997

Digital Library

Google Scholar

[6]

Ching-Han Tasi, and Sung-Mo Kang, "Cell-Level Placement for Improving Substrate Thermal Distribution," IEEE Trans. Computer-Aided Design of Integrated Circuits and Systems pp253-266, Vol. 19, No. 2, Feb. 2000

Digital Library

Google Scholar

[7]

Danqing Chen, Erhong Li, Elyse Rosenbaum, and Sung-Mo Kang," Interconect Thermal Modeling for Accurate Simulation of Circuit Timing and Reliability," IEEE Trans. Computer-Aided Design of Integrated Circuits and Systems pp197-205, Vol. 19, No. 2, Feb. 2000

Digital Library

Google Scholar

[8]

Kaustav Banerjee, Amit Mehrotra, Alberto Sangiovanni-Vincentelli, and Chenming Hu "On Thermal Effects in Deep Sub-Micron VLSI Interconnects," DAC99 pp 885-891, 1999.

Digital Library

Google Scholar

[9]

Zhiping Yu, Dan Yergeau, and Robert W. Dutton, "Full Chip Thermal Simulation," ISQED 2000 Quality Electronic Design

Digital Library

Google Scholar

[10]

Peaceman, D. W., and H. H. Rachford, Jr., "The numerical solution of parabolic and elliptic differential equations," J. Soc. Indust. Appl. Math., pp 28-41, 3, 1955

Google Scholar

[11]

Jim Douglas, Jr., and James E. Gunn, "A General Formulation of Alternating Direction Methods-Part I. Parabolic and Hyperbolic Problems," Numerische Mathematik pp 428-453, 6, 1964

Google Scholar

[12]

Glen E. Myers, "Analytical Methods in Conduction Heat Transfer," Journal of Digital Systems Genium Publishing Corp. Chap 8, 2nd Edition, 1998.

Google Scholar

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Khodabandeloo BKhonsari AJasemi MTaheri G(2017)A fast temperature-aware fixed-outline floorplanning framework using convex optimizationIntegration10.1016/j.vlsi.2017.01.00758(101-110)Online publication date: Jun-2017
https://doi.org/10.1016/j.vlsi.2017.01.007
Guthaus MWilke GReis R(2013)Revisiting automated physical synthesis of high-performance clock networksACM Transactions on Design Automation of Electronic Systems10.1145/2442087.244210218:2(1-27)Online publication date: 11-Apr-2013
https://dl.acm.org/doi/10.1145/2442087.2442102
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https://doi.org/10.1007/s00024-012-0637-7
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Index Terms

Thermal-ADI: a linear-time chip-level dynamic thermal simulation algorithm based on alternating-direction-implicit (ADI) method
1. Applied computing
  1. Physical sciences and engineering
2. Hardware
  1. Very large scale integration design

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Published In

ISPD '01: Proceedings of the 2001 international symposium on Physical design

April 2001

245 pages

ISBN:1581133472

DOI:10.1145/369691

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Association for Computing Machinery

New York, NY, United States

Publication History

Published: 01 April 2001

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ISPD01: International Symposium on Physical Design

April 1 - 4, 2001

California, Sonoma, USA

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Overall Acceptance Rate 62 of 172 submissions, 36%

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Cited By

View all

Khodabandeloo BKhonsari AJasemi MTaheri G(2017)A fast temperature-aware fixed-outline floorplanning framework using convex optimizationIntegration10.1016/j.vlsi.2017.01.00758(101-110)Online publication date: Jun-2017
https://doi.org/10.1016/j.vlsi.2017.01.007
Guthaus MWilke GReis R(2013)Revisiting automated physical synthesis of high-performance clock networksACM Transactions on Design Automation of Electronic Systems10.1145/2442087.244210218:2(1-27)Online publication date: 11-Apr-2013
https://dl.acm.org/doi/10.1145/2442087.2442102
Ghani IKoehn DToussaint RPasschier C(2013)Dynamic Development of HydrofracturePure and Applied Geophysics10.1007/s00024-012-0637-7170:11(1685-1703)Online publication date: 30-Mar-2013
https://doi.org/10.1007/s00024-012-0637-7
Logan SGuthaus M(2009)Fast thermal-aware floorplanning using white-space optimization2009 17th IFIP International Conference on Very Large Scale Integration (VLSI-SoC)10.1109/VLSISOC.2009.6041332(65-70)Online publication date: Oct-2009
https://doi.org/10.1109/VLSISOC.2009.6041332
Zhong YWong M(2008)Thermal-Aware IR Drop Analysis in Large Power Grid9th International Symposium on Quality Electronic Design (isqed 2008)10.1109/ISQED.2008.4479725(194-199)Online publication date: Mar-2008
https://doi.org/10.1109/ISQED.2008.4479725
Wang TChen C(2006)3-D Thermal-ADIIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2002.80438521:12(1434-1445)Online publication date: 1-Nov-2006
https://dl.acm.org/doi/10.1109/TCAD.2002.804385
Wang JSrinivas BMa DChen CLi J(2005)System-level power and thermal modeling and analysis by orthogonal polynomial based response surface approach (OPRS)Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design10.5555/1129601.1129705(728-735)Online publication date: 31-May-2005
https://dl.acm.org/doi/10.5555/1129601.1129705
Devgan ANassif S(2005)Power Variability and Its Impact on DesignProceedings of the 18th International Conference on VLSI Design held jointly with 4th International Conference on Embedded Systems Design10.1109/ICVD.2005.141(679-682)Online publication date: 3-Jan-2005
https://dl.acm.org/doi/10.1109/ICVD.2005.141
Wang JSrinivas BDongsheng Ma Charlie Chung-Ping Chen Jun Li (2005)System-level power and thermal modeling and analysis by orthogonal polynomial based response surface approach (OPRS)ICCAD-2005. IEEE/ACM International Conference on Computer-Aided Design, 2005.10.1109/ICCAD.2005.1560161(728-735)Online publication date: 2005
https://doi.org/10.1109/ICCAD.2005.1560161
Ting-Yuan Wang Charlie Chung-Ping Chen (2004)SPICE-compatible thermal simulation with lumped circuit modeling for thermal reliability analysis based on modeling order reductionSCS 2003. International Symposium on Signals, Circuits and Systems. Proceedings (Cat. No.03EX720)10.1109/ISQED.2004.1283700(357-362)Online publication date: 2004
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