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Pre-layout prediction of interconnect manufacturability

Published: 01 March 2001 Publication History

Abstract

Functional yield is a term used to describe the percentage of dies on a wafer that fail due to catastrophic defects. Within the interconnect these defects are usually caused by particle contamination and are divided into bridging defects, which join adjacent wires, and cuts, which result in broken wires. The probability of failure is therefore determined by the geometry of the routing channels and the distribution of defect sizes. Since the wire spacing and width are usually fixed, and the distribution of defects within a mature production facility is well known, the problem reduces to estimating individual wire lengths for cuts, and to estimating the overlapping distance that two wires share in neighboring sections of the routing grid for bridges. Since the probability of failure is determined by the behavior of the wires averaged over the entire interconnect, the application of System Level Interconnect Prediction (SLIP) techniques is particularly appropriate. This paper presents a method for utilizing previously developed techniques for wire length estimation and layer assignment and applies them to the problem of cut and bridge functional yield estimation.

References

[1]
W. E. Donath, "Statistical properties of the placement of a graph," SIAM J. Applied Mathematics, vol. 16, no. 2, pp. 439-457, 1968.
[2]
B. S. Landman and R. L. Russo, "On a pin versus block relationship for partitions of logic graphs," IEEE Trans. Computers, vol. 20, pp. 1469, 1971.
[3]
W. E. Donath, "On the equivalence of memory to random logic," IBM J. Res. Dev, vol. 18, pp. 401-407, 1974.
[4]
W. R. Heller, W. F. Mikhail, and W. E. Donath, "Prediction of wiring space requirements for LSI," Design Automat. Fault-Tolerant Comput., pp. 117-144, 1978.
[5]
M. Feuer, "Connectivity of random logic," IEEE Trans. Computers, vol. C-31, pp. 29-33, 1982.
[6]
W. R. Heller, C. G. Hsi, and W. F. Mikhaill, "Wirability|designing wiring space for chips and chip packages," IEEE Design and Test Magazine, pp. 43-51, AUGUST 1984.
[7]
T. Chiba, 'Impact of the LSI on high-speed computer packaging," IEEE Trans. Computers, vol. C-27, pp. 319-325, 1978.
[8]
W.E. Donath, "Placements and average interconnection lengths of computer logic," IEEE Trans. Circuits and Systems, vol. CAS-26, no. 4, pp. 272-277, 1979.
[9]
N. Harada, "LSI interconnect length prediction method using statistical mechanical placements theory," NEC Research and Development Journal, vol. 72, pp. 56-63, January 1984.
[10]
Wilm Donath, "Wire length distribution for placements of computer logic," IBM J. Res. Develop., vol. 25, no. 3, pp. 152-155, May 1981.
[11]
D. K. Ferry, 'Interconnection lengths and VLSI," IEEE Circuits and Devices Magazine, pp. 39-42, July 1985.
[12]
H. B. Bakoglu and J. D. Meindl, "A system level circuit model for multi- and single chip cpus," in IEEE International Solid State Circuits Conference (ISSCC `87), 1987, pp. 308-309. Nether-
[13]
H. B. Bakoglu, Circuits, Interconnections, and Packaging for VLSI, Addison-Wesley, 1990.
[14]
J. Davis and J. D. Meindl, "Optimal low power interconnect networks," in Proc. IEEE Symposium on VLSI Technology, 1996, pp. 78-79.
[15]
J. A. Davis, V. De, and J. D. Meindl, "A stochastic wire-length distribution for gigascale integration (GSI)|part II: Applications to clock frequency, power dissipation, and chip size estimation," IEEE Trans. Electron Devices, vol. 45, no. 3, pp. 591-597, March 1998.
[16]
A. Kahng and D. Stroobandt, 'Wiring layer assignmements with constant stage delays," in Proc. 2nd. International Workshop on System Level Interconnect Prediction. MARCH 2000, pp. 115-122, ACM.
[17]
J. W. Joyner, P. Zarkesh-Ha, J. A. Davis, and J. D. Meindl, "Vertical pitch limitations on performance enhancement in bonded three-dimensional interconnect architectures," in Proc. 2nd International Workshop on System Level Interconnect Prediction. 2000, pp. 123-127, ACM.
[18]
T. N. Theis, "The future of interconnection technology," IBM J. Research and Development, vol. 44, no. 3, pp. 379-390, 2000.
[19]
G. A. Sai-Halasz, "Performance trends in high-end processors," Proc. IEEE, vol. 83, pp. 18, 1995.
[20]
A. Kahng, S. Mantik, and D. Stroobandt, "Requirements for models of achievable routing," in Proc. International Symposium on Physical Design. April 2000, pp. 4-11, ACM.
[21]
P. Chong and R. K. Brayton, "Estimating and optimizing routing utilization in dsm design," in Proc. 1st International Workshop on System Level Interconnect Prediction. March 1999, pp. 97-102, ACM.
[22]
I. Chen and A.J. Strojwas, "Rye: Realistic yield simulator for VLSI structural failures," in Proc. IEEE Int. Test Conference, 1987, pp. 31-42.
[23]
D. M. H. Walker, Yield Simulation for Integrated Circuits, Kluwer, Boston MA, 1987.
[24]
P. Schvan, D.Y. Montuno, and R. Hadaway, Defect and Fault Tolerance in VLSI Systems, vol. 1, pp. 117-127, Plenum, New York, 1989.
[25]
J. Pineda de Gyvez and C. Di, "IC defect sensitivity for footprint-type defects," IEEE Trans. on Computer-Aided Design, vol. 11, pp. 638-658, May 1992.
[26]
G. A. Allan and J.A. Walton, "Hierarchical critical area extraction with the eye tool,"inProc. IEEE Int. Workshop on Defect and Fault Tolerance in VLSI Systems, November 1995, pp. 28-36.
[27]
P. K. Nag and W. Maly, "Hierarchical extraction of critical areas for shorts and very large ICs," in Proc. IEEE Int. Workshop on Defect and Fault Tolerance in VLSI Systems, November 1995, pp. 19-27.
[28]
S.Y. Kuo, "Yor: A yield optimizing routing algorithm by minimizing critical areas and vias," IEEE Trans. on Computer Aided Design, vol. 12, pp. 1303-1311, September 1993.
[29]
E.P. Huijbregts, H.Xue, and J.A.G. Jess, "Routing for reliable manufacturing," IEEE Trans. on Semiconductor Manufacturing, vol. 8, pp. 188-194, May 1995.
[30]
V. K. R. Chilivuri and I. Koren, "Layout synthesis techniques for yield enhancement," IEEE Trans. on Semiconductor Manufacturing, vol. 8, pp. 178-187, May 1995.
[31]
P. Li,P. K. Nag, and W. Maly, "Cost based tradeoff analysis of standard cell designs," in Proc. Int. Workshop on System Level Interconnect Prediction. April 2000, pp. 129-135, ACM Press.
[32]
R. K. Prasad and I. Koren, "The effects of placement on yield for standard cell design," in Proc. IEEE Int. Symposium on Defect and Fault Tolerance in VLSI Systems, October 2000, pp. 3-11.
[33]
H. T. Heineken and W. Maly, "Interconnect yield model for manufacturability prediction in synthesis of standard cell based designs," in Proc. IEEE International Conference on Computer Aided Design(ICCAD). 1996, pp. 368-373, IEEE Computer Society Press.
[34]
C. H. Stapper, "Modeling of defects in integrated circuit photolithographic patterns," IBM J. Research and Development, vol. 28, no. 4, pp. 461-475, 1984.
[35]
Phillip Christie and Dirk Stroobandt, "The interpretation and application of Rent's rule," IEEE Trans. on VLSI Systems, vol. 8(6), pp. 639-648, December 2000.
[36]
Phillip Christie, "A differential equation for placement analysis," Submitted to IEEE Trans. on VLSI Systems, 2000.

Cited By

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  • (2014)Predictive Application of PIDF and PPC for Interconnects' Crosstalk, TSV, and LER Issues in UDSM ICs and Nano-SystemsIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2013.224384922:2(438-443)Online publication date: 1-Feb-2014
  • (2011)A Predictive and Accurate Interconnect Density FunctionIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2010.205394619:9(1704-1717)Online publication date: 1-Sep-2011
  • (2009)Random Yield Prediction Based on a Stochastic Layout Sensitivity ModelIEEE Transactions on Semiconductor Manufacturing10.1109/TSM.2009.202482122:3(329-337)Online publication date: Aug-2009
  • Show More Cited By

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cover image ACM Conferences
SLIP '01: Proceedings of the 2001 international workshop on System-level interconnect prediction
March 2001
178 pages
ISBN:1581133154
DOI:10.1145/368640
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Published: 01 March 2001

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Author Tags

  1. Rent's rule
  2. critical areas
  3. design
  4. interconnect
  5. reliability
  6. theory
  7. yield

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Overall Acceptance Rate 6 of 8 submissions, 75%

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Cited By

View all
  • (2014)Predictive Application of PIDF and PPC for Interconnects' Crosstalk, TSV, and LER Issues in UDSM ICs and Nano-SystemsIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2013.224384922:2(438-443)Online publication date: 1-Feb-2014
  • (2011)A Predictive and Accurate Interconnect Density FunctionIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2010.205394619:9(1704-1717)Online publication date: 1-Sep-2011
  • (2009)Random Yield Prediction Based on a Stochastic Layout Sensitivity ModelIEEE Transactions on Semiconductor Manufacturing10.1109/TSM.2009.202482122:3(329-337)Online publication date: Aug-2009
  • (2009)A Layout Sensitivity Model for Estimating Electromigration-vulnerable Narrow InterconnectsJournal of Electronic Testing: Theory and Applications10.1007/s10836-008-5079-x25:1(67-77)Online publication date: 1-Feb-2009
  • (2008)Predictive Estimation for Distribution of Interconnects2008 12th IEEE Workshop on Signal Propagation on Interconnects10.1109/SPI.2008.4558403(1-4)Online publication date: May-2008
  • (2007)Stochastic interconnect layout sensitivity modelProceedings of the 2007 international workshop on System level interconnect prediction10.1145/1231956.1231959(9-14)Online publication date: 17-Mar-2007
  • (2007)Estimation of Electromigration-Aggravating Narrow Interconnects Using a Layout Sensitivity Model22nd IEEE International Symposium on Defect and Fault-Tolerance in VLSI Systems (DFT 2007)10.1109/DFT.2007.12(59-67)Online publication date: Sep-2007
  • (2004)Prediction of interconnect adjacency distributionProceedings of the 2004 international workshop on System level interconnect prediction10.1145/966747.966767(99-106)Online publication date: 14-Feb-2004
  • (2003)Prediction of interconnect pattern density distributionProceedings of the 2003 international workshop on System-level interconnect prediction10.1145/639929.639946(85-91)Online publication date: 5-Apr-2003
  • (2003)Multi-objective optimization of interconnect geometryIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2002.80846011:1(15-23)Online publication date: 1-Feb-2003
  • Show More Cited By

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