research-article

Interconnection and double layer for flexible electronic circuit with instant inkjet circuits

Authors:

Masaaki Fukumoto,

Yoshihiro Kawahara,

Tohru AsamiAuthors Info & Claims

UbiComp '15: Proceedings of the 2015 ACM International Joint Conference on Pervasive and Ubiquitous Computing

Pages 181 - 190

https://doi.org/10.1145/2750858.2804276

Published: 07 September 2015 Publication History

Abstract

Instant Inkjet Circuits by silver nano-particle ink realized home-brew electric circuit fabrication. However, current method can support only single-layered patterns, and conventional inter-layer connection methods are not suitable. In this paper, we will evaluate various easy-to-use inter-layer connection methods by making via holes, especially the ones made by different drilling mechanisms. We show that the felting needle is the best candidate as it can establish good conductivity immediately after nano-particle ink is printed into the hole, without using any curing process.

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Cited By

Karpagaraj AGopikrishnan TSingh S(2024)Reuse and Recycling of Electronic Waste from a Global Solution PerspectiveElectronic Waste Management10.1002/9781119891543.ch9(104-123)Online publication date: 6-Feb-2024
https://doi.org/10.1002/9781119891543.ch9
Smith CDowney A(2023)Additively Manufactured Flexible Hybrid Electronic Sensor for Discrete Fatigue Crack DetectionAIAA SCITECH 2023 Forum10.2514/6.2023-2417Online publication date: 16-Jan-2023
https://doi.org/10.2514/6.2023-2417
Kato KIkematsu KIgarashi YKawahara Y(2022)Paper-Woven Circuits: Fabrication Approach for Papercraft-based Electronic DevicesProceedings of the Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction10.1145/3490149.3502253(1-11)Online publication date: 13-Feb-2022
https://dl.acm.org/doi/10.1145/3490149.3502253
Show More Cited By

Index Terms

Interconnection and double layer for flexible electronic circuit with instant inkjet circuits

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Published In

cover image ACM Conferences

UbiComp '15: Proceedings of the 2015 ACM International Joint Conference on Pervasive and Ubiquitous Computing

September 2015

1302 pages

ISBN:9781450335744

DOI:10.1145/2750858

General Chairs:
Kenji Mase
Nagoya University, JP
,
Marc Langheinrich
Università della Svizzera italiana (USI), CH
,
Daniel Gatica-Perez
IDIAP-EPFL, CH
,
Program Chairs:
Hans Gellersen
Lancaster University, UK
,
Tanzeem Choudhury
Cornell University
,
Koji Yatani
Univerisity of Tokyo, JP

Copyright © 2015 ACM.

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than the author(s) must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected].

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Yahoo! Japan: Yahoo! Japan
SIGMOBILE: ACM Special Interest Group on Mobility of Systems, Users, Data and Computing
FX Palo Alto Laboratory, Inc.: FX Palo Alto Laboratory, Inc.
Google Inc.
ACM: Association for Computing Machinery
Rakuten Institute of Technology: Rakuten Institute of Technology
Microsoft: Microsoft
Bell Labs: Bell Laboratories
SIGCHI: ACM Special Interest Group on Computer-Human Interaction
KDDI
Panasonic: Panasonic Corporation
NTT DoCoMo
Telefónica: Telefónica
ISTC-PC: Intel Science and Technology Center for Pervasive Computing

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Association for Computing Machinery

New York, NY, United States

Publication History

Published: 07 September 2015

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UbiComp '15

Sponsor:

Yahoo! Japan
SIGMOBILE
FX Palo Alto Laboratory, Inc.
ACM
Rakuten Institute of Technology
Microsoft
Bell Labs
SIGCHI
Panasonic
Telefónica
ISTC-PC

UbiComp '15: The 2015 ACM International Joint Conference on Pervasive and Ubiquitous Computing

September 7 - 11, 2015

Osaka, Japan

Acceptance Rates

UbiComp '15 Paper Acceptance Rate 101 of 394 submissions, 26%;

Overall Acceptance Rate 764 of 2,912 submissions, 26%

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Cited By

Karpagaraj AGopikrishnan TSingh S(2024)Reuse and Recycling of Electronic Waste from a Global Solution PerspectiveElectronic Waste Management10.1002/9781119891543.ch9(104-123)Online publication date: 6-Feb-2024
https://doi.org/10.1002/9781119891543.ch9
Smith CDowney A(2023)Additively Manufactured Flexible Hybrid Electronic Sensor for Discrete Fatigue Crack DetectionAIAA SCITECH 2023 Forum10.2514/6.2023-2417Online publication date: 16-Jan-2023
https://doi.org/10.2514/6.2023-2417
Kato KIkematsu KIgarashi YKawahara Y(2022)Paper-Woven Circuits: Fabrication Approach for Papercraft-based Electronic DevicesProceedings of the Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction10.1145/3490149.3502253(1-11)Online publication date: 13-Feb-2022
https://dl.acm.org/doi/10.1145/3490149.3502253
Ishii AKato KIkematsu KKawahara YSiio I(2022)CircWood: Laser Printed Circuit Boards and Sensors for Affordable DIY WoodworkingProceedings of the Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction10.1145/3490149.3501317(1-11)Online publication date: 13-Feb-2022
https://dl.acm.org/doi/10.1145/3490149.3501317
Ta TOkuya FKawahara Y(2021)Traveling Salesman Problem Based Auto-Router for Designing LEDs Applications with Conductive Inkjet PrintingSICE Journal of Control, Measurement, and System Integration10.9746/jcmsi.11.29211:4(292-301)Online publication date: 18-Jan-2021
https://doi.org/10.9746/jcmsi.11.292
Imai YManabe H(2021)Single-sided Multi-layer Electric Circuit by Hot Stamping with 3D PrinterAdjunct Proceedings of the 34th Annual ACM Symposium on User Interface Software and Technology10.1145/3474349.3480200(126-128)Online publication date: 10-Oct-2021
https://dl.acm.org/doi/10.1145/3474349.3480200
Kato KIkematsu KKawahara Y(2020)CAPath: 3D-Printed Interfaces with Conductive Points in Grid Layout to Extend Capacitive Touch InputsProceedings of the ACM on Human-Computer Interaction10.1145/34273214:ISS(1-17)Online publication date: 4-Nov-2020
https://dl.acm.org/doi/10.1145/3427321
Rahman MKim SPhung TLee JYu JKwon K(2020)Three-dimensional surface printing method for interconnecting electrodes on opposite sides of substratesScientific Reports10.1038/s41598-020-75556-x10:1Online publication date: 29-Oct-2020
https://doi.org/10.1038/s41598-020-75556-x
Xu ZWong PGong JWu TNittala ABi XSteimle JFu HZhu KYang XGuimbretière FBernstein MReinecke K(2019)TipText: Eyes-Free Text Entry on a Fingertip KeyboardProceedings of the 32nd Annual ACM Symposium on User Interface Software and Technology10.1145/3332165.3347865(883-899)Online publication date: 17-Oct-2019
https://dl.acm.org/doi/10.1145/3332165.3347865
Ji SChoi WKim HJeon JCho SChang W(2018)Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser ProcessingMaterials10.3390/ma1102026811:2(268)Online publication date: 9-Feb-2018
https://doi.org/10.3390/ma11020268
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