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Low-cost On-Chip Structures for Combating Die and IC Recycling

Published: 01 June 2014 Publication History

Abstract

The recycling of electronic components has become a major concern for the industry and government as it potentially impacts the security and reliability of a wide variety of electronic systems. The sheer number of component types (analog, digital, mixed-signal) and sizes (large or small) makes it extremely challenging to find a one-size-fits-all solution to detect and prevent recycled ICs. In this paper, we propose a suite of solutions for combating die and IC recycling (CDIR). These solutions include light-weight, on-chip structures based on ring oscillators (RO-CDIR), anti-fuses (AF-CDIR) and fuses (F-CDIR). Each structure meets the unique needs and limitations of different part types and sizes providing excellent coverage of recycled parts. HSPICE simulation results using 90nm technology demonstrate the effectiveness of our proposed negative-bias temperature instability (NBTI)-aware RO-CDIR for detecting ICs used for very short period of time. Recycling of large digital ICs can effectively be detected by using AF-CDIR. Small analog and digital recycled components can be identified by testing our F-CDIR with very low cost measurement devices, e.g., a multimeter.

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  • (2024)SAP: Silicon Authentication Platform for System-on-Chip Supply Chain Vulnerabilities2024 IEEE International Symposium on Performance Analysis of Systems and Software (ISPASS)10.1109/ISPASS61541.2024.00020(109-119)Online publication date: 5-May-2024
  • (2024)Advancing Trustworthiness in System-in-Package: A Novel Root-of-Trust Hardware Security Module for Heterogeneous IntegrationIEEE Access10.1109/ACCESS.2024.337587412(48081-48107)Online publication date: 2024
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cover image ACM Other conferences
DAC '14: Proceedings of the 51st Annual Design Automation Conference
June 2014
1249 pages
ISBN:9781450327305
DOI:10.1145/2593069
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Publication History

Published: 01 June 2014

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Author Tags

  1. Counterfeit ICs
  2. Design for Anti-Counterfeit
  3. Recycling
  4. Remarking

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DAC '14

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Overall Acceptance Rate 1,770 of 5,499 submissions, 32%

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Cited By

View all
  • (2024)A Novel Self-referencing Approach Using Memory Power-up States for Detecting COTS SRAMs2024 IEEE 42nd VLSI Test Symposium (VTS)10.1109/VTS60656.2024.10538766(1-7)Online publication date: 22-Apr-2024
  • (2024)SAP: Silicon Authentication Platform for System-on-Chip Supply Chain Vulnerabilities2024 IEEE International Symposium on Performance Analysis of Systems and Software (ISPASS)10.1109/ISPASS61541.2024.00020(109-119)Online publication date: 5-May-2024
  • (2024)Advancing Trustworthiness in System-in-Package: A Novel Root-of-Trust Hardware Security Module for Heterogeneous IntegrationIEEE Access10.1109/ACCESS.2024.337587412(48081-48107)Online publication date: 2024
  • (2024)Recycled Counterfeit Chips Detection for AMS and Digital ICs Using Low-Area, Self-Contained, and Secure LDO OdometersJournal of Hardware and Systems Security10.1007/s41635-024-00152-8Online publication date: 18-Jul-2024
  • (2023)Heterogeneous Integration Supply Chain Integrity Through Blockchain and CHSMACM Transactions on Design Automation of Electronic Systems10.1145/362582329:1(1-25)Online publication date: 6-Oct-2023
  • (2023)A Survey and Perspective on Artificial Intelligence for Security-Aware Electronic Design AutomationACM Transactions on Design Automation of Electronic Systems10.1145/356339128:2(1-57)Online publication date: 6-Mar-2023
  • (2023)Golden-Free Robust Age Estimation to Triage Recycled ICsIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2023.323829142:9(2839-2851)Online publication date: Sep-2023
  • (2023)A Brief Tutorial on Mixed Signal Approaches to Combat Electronic CounterfeitingIEEE Open Journal of Circuits and Systems10.1109/OJCAS.2023.32531444(99-114)Online publication date: 2023
  • (2023)Enabling Security of Heterogeneous Integration: From Supply Chain to In-Field OperationsIEEE Design & Test10.1109/MDAT.2023.327023440:5(86-95)Online publication date: Oct-2023
  • (2023)Design and Security-Mitigation of Custom and Configurable Hardware Cryptosystems2023 IEEE 16th Dallas Circuits and Systems Conference (DCAS)10.1109/DCAS57389.2023.10130190(1-6)Online publication date: 14-Apr-2023
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