research-article

Low-cost On-Chip Structures for Combating Die and IC Recycling

Authors:

Mohammad TehranipoorAuthors Info & Claims

DAC '14: Proceedings of the 51st Annual Design Automation Conference

Pages 1 - 6

https://doi.org/10.1145/2593069.2593157

Published: 01 June 2014 Publication History

Abstract

The recycling of electronic components has become a major concern for the industry and government as it potentially impacts the security and reliability of a wide variety of electronic systems. The sheer number of component types (analog, digital, mixed-signal) and sizes (large or small) makes it extremely challenging to find a one-size-fits-all solution to detect and prevent recycled ICs. In this paper, we propose a suite of solutions for combating die and IC recycling (CDIR). These solutions include light-weight, on-chip structures based on ring oscillators (RO-CDIR), anti-fuses (AF-CDIR) and fuses (F-CDIR). Each structure meets the unique needs and limitations of different part types and sizes providing excellent coverage of recycled parts. HSPICE simulation results using 90nm technology demonstrate the effectiveness of our proposed negative-bias temperature instability (NBTI)-aware RO-CDIR for detecting ICs used for very short period of time. Recycling of large digital ICs can effectively be detected by using AF-CDIR. Small analog and digital recycled components can be identified by testing our F-CDIR with very low cost measurement devices, e.g., a multimeter.

References

[1]

A. T. Appel. Rectangular contact used as a low voltage fuse element, Aug 2004.

[2]

J. Chen, S. Wang, and M. Tehranipoor. Efficient Selection and Analysis of Critical-reliability Paths and Gates. In GLSVLSI, pages 45--50, 2012.

Digital Library

[3]

G. Contreras, T. Rahman, and M. Tehranipoor. Secure Split-Test for Preventing IC Piracy by Untrusted Foundry and Assembly. In Proc. International Symposium on Fault and Defect Tolerance in VLSI Systems, 2013.

[4]

U. Guin, D. DiMase, and M. Tehranipoor. A comprehensive framework for counterfeit defect coverage analysis and detection assessment. Journal of Electronic Testing, 30(1):25--40, 2014.

Digital Library

[5]

U. Guin, D. DiMase, and M. Tehranipoor. Counterfeit integrated circuits: Detection, avoidance, and the challenges ahead. Journal of Electronic Testing, 30(1):9--23, 2014.

Digital Library

[6]

C. Hu, S. C.Tam, F.-C. Hsu, P.-K. Ko, T.-Y. Chan, and K. Terrill. Hot-Electron-Induced MOSFET Degradation - Model, Monitor, and Improvement. JSSC, 20(1):295--305, 1985.

[7]

K. Huang, J. Carulli, and Y. Makris. Parametric counterfeit IC detection via Support Vector Machines. In Proc. International Symposium on Fault and Defect Tolerance in VLSI Systems, pages 7--12, 2012.

Digital Library

[8]

IDEA. Acceptability of electronic components distributed in the open market. http://www.idofea.org/products/118-idea-std-1010b.

[9]

IHS iSuppli. Top 5 Most Counterfeited Parts Represent a $169 Billion Potential Challenge for Global Semiconductor Market, 2011.

[10]

B. Kaminska, K. Arabi, I. Bell, P. Goteti, J. Huertas, B. Kim, A. Rueda, and M. Soma. Analog and mixed-signal benchmark circuits-first release. In ITC, pages 183--190, 1997.

Digital Library

[11]

L. W. Kessler and T. Sharpe. Faked Parts Detection. Circuits Assembly, The Journal for Surface Mount and Electronics Assembly, June 2010.

[12]

F. Koushanfar and G. Qu. Hardware metering. In Proc. IEEE-ACM Design Automation Conference, pages 490--493, 2001.

Digital Library

[13]

C. Kuemin, L. Nowack, L. Bozano, N. D. Spencer, and H. Wolf. Oriented assembly of gold nanorods on the single-particle level. Advanced Functional Materials, 22(4):702--708, 2012.

[14]

M. Miller, J. Meraglia, and J. Hayward. Traceability in the age of globalization: A proposal for a marking protocol to assure authenticity of electronic parts. In SAE Aerospace Electronics and Avionics Systems Conference, October 2012.

[15]

H. C. Nicolay. Integrated circuit fuse, Jun 1981.

[16]

R. Pappu. Physical one-way functions. PhD thesis, Massachusetts Institute of Technology, 2001.

Digital Library

[17]

N. Robson, J. Safran, C. Kothandaraman, A. Cestero, X. Chen, R. Rajeevakumar, A. Leslie, D. Moy, T. Kirihata, and S. Iyer. Electrically programmable fuse (efuse): From memory redundancy to autonomic chips. In CICC, pages 799--804, 2007.

[18]

SAE. Counterfeit electronic parts; avoidance, detection, mitigation, and disposition, 2009. http://standards.sae.org/as5553/.

[19]

Semiconductor Industry Association (SIA). Public Comments - DNA Authentication Marking on Items in FSC5962, November 2012.

[20]

Synopsys. 90nm Generic Library.

[21]

B. Tudor, J. Wang, Z. Chen, R. Tan, W. Liu, and F. Lee. An accurate MOSFET aging model for 28 nm integrated circuit simulation. Microelectronics Reliability, 52(8):1565--1570, 2012.

[22]

X. Zhang and M. Tehranipoor. Design of On-chip Light-weight Sensors for Effective Detection of Recycled ICs. IEEE Transactions on VLSI Systems, 2013.

[23]

X. Zhang, N. Tuzzio, and M. Tehranipoor. Identification of recovered ics using fingerprints from a light-weight on-chip sensor. In Proc. IEEE-ACM Design Automation Conference, pages 703 --708, June 2012.

Digital Library

[24]

X. Zhang, K. Xiao, and M. Tehranipoor. Path-delay fingerprinting for identification of recovered ics. In Proc. International Symposium on Fault and Defect Tolerance in VLSI Systems, October 2012.

Digital Library

Cited By

Odom GTisha ZGuin U(2024)A Novel Self-referencing Approach Using Memory Power-up States for Detecting COTS SRAMs2024 IEEE 42nd VLSI Test Symposium (VTS)10.1109/VTS60656.2024.10538766(1-7)Online publication date: 22-Apr-2024
https://doi.org/10.1109/VTS60656.2024.10538766
Kovacs ICărbunescu-Stoenescu BŢopa MBuzo ADavid EPelz G(2024)Frontend-Backend Integrated Circuit Device Linking Using Machine Learning Algorithms2024 20th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)10.1109/SMACD61181.2024.10745402(1-4)Online publication date: 2-Jul-2024
https://doi.org/10.1109/SMACD61181.2024.10745402
Ul Islam Sami MZhou JSaha SRahman FFarahmandi FTehranipoor M(2024)SAP: Silicon Authentication Platform for System-on-Chip Supply Chain Vulnerabilities2024 IEEE International Symposium on Performance Analysis of Systems and Software (ISPASS)10.1109/ISPASS61541.2024.00020(109-119)Online publication date: 5-May-2024
https://doi.org/10.1109/ISPASS61541.2024.00020
Show More Cited By

Recommendations

A novel area efficient on-chip RO-Sensor for recycled IC detection
Abstract
Out of different types of counterfeit integrated circuits (ICs) present in the supply chain, recycled ICs are major threat to security and reliability of electronic components. Recycled ICs possess shorter lifetime and it is extremely ...
Highlights
- The proposed light weight RO sensor is suitable for recycled IC detection.
- It ...
A zero-overhead IC identification technique using clock sweeping and path delay analysis
GLSVLSI '12: Proceedings of the great lakes symposium on VLSI

The counterfeiting of integrated circuits (ICs) has become a major issue for the electronics industry. Counterfeit ICs that find their way into the supply chains of critical applications can have a major impact on the security and reliability of those ...
Design of Accurate Low-Cost On-Chip Structures for Protecting Integrated Circuits Against Recycling
The recycling of electronic components has become a major industrial and governmental concern, as it could potentially impact the security and reliability of a wide variety of electronic systems. It is extremely challenging to detect a recycled integrated ...

Comments

Please enable JavaScript to view thecomments powered by Disqus.

Information & Contributors

Information

Published In

cover image ACM Other conferences

DAC '14: Proceedings of the 51st Annual Design Automation Conference

June 2014

1249 pages

ISBN:9781450327305

DOI:10.1145/2593069

Copyright © 2014 ACM.

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

In-Cooperation

EDAC: Electronic Design Automation Consortium
SIGBED: ACM Special Interest Group on Embedded Systems
SIGDA: ACM Special Interest Group on Design Automation
IEEE-CEDA

Publisher

Association for Computing Machinery

New York, NY, United States

Publication History

Published: 01 June 2014

Permissions

Request permissions for this article.

Request Permissions

Check for updates

Author Tags

Qualifiers

Research-article
Research
Refereed limited

Conference

DAC '14

DAC '14: The 51st Annual Design Automation Conference 2014

June 1 - 5, 2014

CA, San Francisco, USA

Acceptance Rates

Overall Acceptance Rate 1,770 of 5,499 submissions, 32%

Contributors

Other Metrics

View Article Metrics

Bibliometrics & Citations

Bibliometrics

Article Metrics

68
Total Citations
View Citations
299
Total Downloads

Downloads (Last 12 months)20
Downloads (Last 6 weeks)5

Reflects downloads up to 05 Mar 2025

Other Metrics

View Author Metrics

Citations

Cited By

Odom GTisha ZGuin U(2024)A Novel Self-referencing Approach Using Memory Power-up States for Detecting COTS SRAMs2024 IEEE 42nd VLSI Test Symposium (VTS)10.1109/VTS60656.2024.10538766(1-7)Online publication date: 22-Apr-2024
https://doi.org/10.1109/VTS60656.2024.10538766
Kovacs ICărbunescu-Stoenescu BŢopa MBuzo ADavid EPelz G(2024)Frontend-Backend Integrated Circuit Device Linking Using Machine Learning Algorithms2024 20th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)10.1109/SMACD61181.2024.10745402(1-4)Online publication date: 2-Jul-2024
https://doi.org/10.1109/SMACD61181.2024.10745402
Ul Islam Sami MZhou JSaha SRahman FFarahmandi FTehranipoor M(2024)SAP: Silicon Authentication Platform for System-on-Chip Supply Chain Vulnerabilities2024 IEEE International Symposium on Performance Analysis of Systems and Software (ISPASS)10.1109/ISPASS61541.2024.00020(109-119)Online publication date: 5-May-2024
https://doi.org/10.1109/ISPASS61541.2024.00020
Sami MZhang TShuvo AHaque MCalzada PAzar KKamali HRahman FFarahmandi FTehranipoor M(2024)Advancing Trustworthiness in System-in-Package: A Novel Root-of-Trust Hardware Security Module for Heterogeneous IntegrationIEEE Access10.1109/ACCESS.2024.337587412(48081-48107)Online publication date: 2024
https://doi.org/10.1109/ACCESS.2024.3375874
Roy SChen JMaghari NForte D(2024)Recycled Counterfeit Chips Detection for AMS and Digital ICs Using Low-Area, Self-Contained, and Secure LDO OdometersJournal of Hardware and Systems Security10.1007/s41635-024-00152-8Online publication date: 18-Jul-2024
https://doi.org/10.1007/s41635-024-00152-8
Calzada PSami MAzar KRahman FFarahmandi FTehranipoor M(2023)Heterogeneous Integration Supply Chain Integrity Through Blockchain and CHSMACM Transactions on Design Automation of Electronic Systems10.1145/362582329:1(1-25)Online publication date: 6-Oct-2023
https://dl.acm.org/doi/10.1145/3625823
Koblah DAcharya RCapecci DDizon-Paradis OTajik SGanji FWoodard DForte D(2023)A Survey and Perspective on Artificial Intelligence for Security-Aware Electronic Design AutomationACM Transactions on Design Automation of Electronic Systems10.1145/356339128:2(1-57)Online publication date: 6-Mar-2023
https://dl.acm.org/doi/10.1145/3563391
Surabhi VKrishnamurthy PAmrouch HHenkel JKarri RKhorrami F(2023)Golden-Free Robust Age Estimation to Triage Recycled ICsIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2023.323829142:9(2839-2851)Online publication date: Sep-2023
https://doi.org/10.1109/TCAD.2023.3238291
Bryant TChen YKoblah DForte DMaghari N(2023)A Brief Tutorial on Mixed Signal Approaches to Combat Electronic CounterfeitingIEEE Open Journal of Circuits and Systems10.1109/OJCAS.2023.32531444(99-114)Online publication date: 2023
https://doi.org/10.1109/OJCAS.2023.3253144
Sami MKamali HFarahmandi FRahman FTehranipoor M(2023)Enabling Security of Heterogeneous Integration: From Supply Chain to In-Field OperationsIEEE Design & Test10.1109/MDAT.2023.327023440:5(86-95)Online publication date: Oct-2023
https://doi.org/10.1109/MDAT.2023.3270234
Show More Cited By

View Options

Login options

Check if you have access through your login credentials or your institution to get full access on this article.

Full Access

Get this Publication

View options

PDF

View or Download as a PDF file.

eReader

View online with eReader.

Figures

Tables

Media

View Table of Conten