As 3D technologies become technologically viable, there is increasinginterest in determining the achievable payoff. This article first presents an overview of 3D technologies and introduces the motivation for moving from 2D to 3D. It then presents a case study of a fast-Fourier-transform design to illustrate the advantages of going to the third dimension.

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Index Terms

Demystifying 3D ICs: The Pros and Cons of Going Vertical
1. Computer systems organization
  1. Architectures
    1. Parallel architectures
      1. Interconnection architectures
2. Hardware

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IEEE Design & Test Volume 22, Issue 6

November 2005

118 pages

ISSN:0740-7475

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Published: 01 November 2005

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https://dl.acm.org/doi/10.1145/3672558
Ma XXu QWang CCao HLiu JZhang DLi Z(2024)An Electrical-Thermal Co-Simulation Model of Chiplet Heterogeneous Integration SystemsIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2024.343049832:10(1769-1781)Online publication date: 1-Oct-2024
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