research-article

Temperature-dependent crosstalk and frequency spectrum analyses in adjacent interconnects of a mixed CNT bundle

Authors:

Mayank Kumar Rai,

Rajesh KhannaAuthors Info & Claims

Journal of Computational Electronics, Volume 19, Issue 1

Pages 177 - 190

https://doi.org/10.1007/s10825-019-01405-4

Published: 01 March 2020 Publication History

Abstract

This paper presents temperature-dependent circuit modeling and performance analyses of single as well as capacitively coupled interconnects of a mixed CNT bundle (MCB) with consideration of the tunneling effect at temperatures from 300 to 500 K at the 14-nm technology node. Four possible MCB structures, viz. MCB-1, MCB-2, MCB-3, and MCB-4, are considered, and their results are compared with those for a copper-based interconnect at the same technology node. For the single line architecture, as the temperature is increased from 300 to 500 K, MCB-4 exhibits a shorter propagation delay in comparison with the other MCBs (1–3) and copper. The results of the frequency spectrum analysis reveal that MCB-4 exhibits a 17.70% wider bandwidth than its copper counterpart. Also, the bandwidth of MCB-4 decreases with increasing temperature, indicating greater signal loss at higher temperatures. For the coupled line architecture, considering different switching conditions of the aggressor and victim lines, MCB-4 exhibits a shorter average dynamic crosstalk-induced delay compared with the other MCBs (1–3) or copper. In comparison with the odd mode of switching, MCB-4 exhibits a 36.45% shorter crosstalk-induced delay with the even mode of switching when the temperature is varied from 300 to 500 K. Similarly, the functional crosstalk noise levels in terms of the overshoot, undershoot, rise glitch, and fall glitch are also found to be significantly lower for MCB-4 compared with the other MCBs (1–3) or copper. The results of the simulations further reveal that MCB-4 exhibits frequency noise components with 70.66% lower amplitude compared with copper, which means that MCB-4 filters more noise components than copper. Furthermore, the amplitude of the frequency noise components increases with rise in temperature.

References

[1]

Li H, Yin WY, Banerjee K, and Mao JF Circuit modeling and performance analysis of multi-walled carbon nanotube interconnects IEEE Trans. Electron Devices 2008

[2]

Rai MK and Khanna R Control of tube parameters on SWCNT bundle interconnect delay and power dissipation Microelectron. Int. 2010

[3]

Sathyakam PU and Mallick S Inter-CNT capacitance in mixed CNT bundle interconnects for VLSI circuits Int. J. Electron. 2012

[4]

Naeemi A and Meindl JD Monolayer metallic nanotube interconnects: promising candidates for short local interconnects IEEE Electron Device Lett. 2005

[5]

Rai M and Sarkar S Maulanda JM Carbon nanotube as a VLSI interconnect Electronic Properties of Carbon Nanotubes 2011 Bolton InTech 475-494

[6]

Naeemi A, Sarvari R, Meindl JD, and Atlantic NW Performance comparison between carbon nanotube and copper interconnects for gigascale integration (GSI) IEEE Electron Device Lett. 2005

[7]

Banerjee, K., Sriavasta, N.: Are carbon nanotubes the future of VLSI interconnections? In: 43rd ACM/IEEE Design Automation Conference (2006). 10.1145/1146909.1147116

[8]

Hosseini A and Shabro V Thermally-aware modeling and performance evaluation for single walled carbon nanotube-based interconnects for future high performance integrated circuits Microelectron. Eng. 2010

[9]

Pop E, Mann DA, Goodson KE, and Dai H Electrical and thermal transport in metallic singlewall carbon nanotubes on insulating substrates J. Appl. Phys. 2012

[10]

Rai MK, Garg H, and Kaushik K Temperature-dependent modeling and crosstalk analysis in mixed carbon nanotube bundle interconnects J. Electron. Mater. 2017

[11]

Majumdar MK and Kaushik BK Analysis of delay and dynamic crosstalk in bundled carbon nanotube interconnects IEEE Trans. Electromagn. Compat. 2014

[12]

Pandya, N.D., Majumdar, M.K., Kaushik, B.K., Manhas, S.K.: Performance comparison of mixed CNT bundle in global VLSI interconnects. In: Proceedings: International Conference Communication Systems and Network Technologies (CSNT) (2012). 10.1109/CSNT.2012.171

[13]

Das, P.K., Majumdar, M.K., Kaushik, B.K., Dasgupta, S.: Analysis of propagation delay in mixed carbon nanotube bundle as global VLSI interconnects. In: Asia Pacific Conference on Postgraduate Research in Microelectronics and Electronics (2012). 10.1109/PrimeAsia.2012.6458638

[14]

Majumdar, M.K., Kumari, A., Alam, A., Kumar, V.R., Kaushik, B.K.: Signal integrity improvement with peripherally placed MWCNTs in mixed CNT bundle based TSVs. In: IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) (2015). 10.1109/EDSSC.2015.7285199

[15]

Majumdar MK, Das PK, and Kaushik BK Delay and crosstalk reliability issues in mixed MWCNT bundle interconnects Microelectron. Reliab. 2014

[16]

Subash S and Kolar J A new spatially rearranged bundle of mixed carbon nanotubes as VLSI interconnection J. Nanotechnol. 2013

[17]

Collins PG and Avouris P Multishell conduction in multiwalled carbon nanotubes Appl. Phys. A 2002

[18]

Yoon Y, Delaney P, and Louie SG Quantum conductance of multiwalled carbon nanotubes Phys. Rev. B 2002

[19]

Rai MK, Kaushik BK, and Sarkar S Thermally aware performance analysis of single-walled carbon nanotube bundle as VLSI interconnects J. Comput. Electron. 2016

[20]

Rai MK and Sarkar S Temperature dependent crosstalk analysis in coupled single-walled carbon nanotube (SWCNT) bundle interconnects Int. J. Circuit Theory Appl. 2015

[21]

Kumar A and Kumar VR Transient analysis of crosstalk induced effects in mixed CNT bundle interconnects using FDTD technique IEEE Trans. Electromagn. Compat. 2018

[22]

Sharda, S., Rai, M.K.: Temperature-dependent delay and power analysis of multilayer graphene nano ribbon interconnects. In: Region-10 IEEE Conference (TENCON) (2017)

[23]

Majumdar MK, Pandya ND, Kaushik BK, and Manhas SK Dynamic crosstalk effect in mixed CNT bundle interconnects Electron. Lett. 2012

[24]

Liang F, Wang S, and Lin H Modeling of crosstalk effects in multiwall carbon nanotube interconnects IEEE Trans. Electromagn. Compat. 2012

[25]

International Technology Roadmap for Semiconductors (ITRS) (2013) (online). http://public.itrs.net. Accessed 22 Jan 2019.

[26]

Predictive Technology Model (PTM) (online). http://ptm.asu.edu/. Accessed 22 Jan 2019.

[27]

Kaushik BK, Agarwal P, and Sarkar S Repeater insertion in crosstalk-aware inductively and capacitively coupled interconnects Int. J. Circuit Theory Appl. 2011

[28]

Majumdar MK, Pandya ND, Kaushik BK, and Manhas SK Analysis of MWCNT and bundled SWCNT interconnects: impact on crosstalk and area IEEE Electron Device Lett. 2012

[29]

Pu SN, Yin WY, and Mao JF Crosstalk prediction of single- and double-walled carbon-nanotube (SWCNT/DWCNT) bundle interconnects IEEE Trans. Electron Devices 2009

[30]

Majumdar MK, Das PK, Kumar VR, and Kaushik BK Crosstalk induced delay analysis of randomly distributed mixed CNT bundle interconnects J. Circuits, Syst. Comput. 2015

[31]

Rossi D, Cazeaux JM, Metra C, and Lombardi F Modeling crosstalk effects in CNT bus architectures IEEE Trans. Nanotechnol. 2007

[32]

Zhang K, Tian B, Zhu X, Wang F, and Wei J Crosstalk analysis of carbon nanotube bundle interconnects Nanoscale Res. Lett. 2012

[33]

Das D and Rahaman H Analysis of crosstalk in single and multiwall carbon nanotube interconnects and its impacts on gate oxide reliability J. Nanotechnol. 2011

[34]

Agarwal K, Sylvester D, and Blauw D Modeling and analysis of crosstalk noise in coupled RLC interconnects IEEE TCAD 2006

Cited By

Sharma MRai MKhanna R(2021)Performance analysis of MCB-based VLSI interconnects depending on scattering induced by substrate surface roughnessJournal of Computational Electronics10.1007/s10825-020-01593-420:1(709-717)Online publication date: 1-Feb-2021
https://dl.acm.org/doi/10.1007/s10825-020-01593-4

Index Terms

Temperature-dependent crosstalk and frequency spectrum analyses in adjacent interconnects of a mixed CNT bundle
1. Applied computing
  1. Physical sciences and engineering
2. Hardware

Index terms have been assigned to the content through auto-classification.

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Published In

cover image Journal of Computational Electronics

Journal of Computational Electronics Volume 19, Issue 1

Mar 2020

492 pages

ISSN:1569-8025

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© Springer Science+Business Media, LLC, part of Springer Nature 2019.

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Springer-Verlag

Berlin, Heidelberg

Publication History

Published: 01 March 2020

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Cited By

Sharma MRai MKhanna R(2021)Performance analysis of MCB-based VLSI interconnects depending on scattering induced by substrate surface roughnessJournal of Computational Electronics10.1007/s10825-020-01593-420:1(709-717)Online publication date: 1-Feb-2021
https://dl.acm.org/doi/10.1007/s10825-020-01593-4

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