article

Rapid hot embossing of polymer microfeatures

Authors:

Thomas E. Kimerling,

Donggang YaoAuthors Info & Claims

Microsystem Technologies, Volume 12, Issue 8

Pages 730 - 735

https://doi.org/10.1007/s00542-006-0098-y

Published: 01 July 2006 Publication History

Abstract

Although the hot embossing process is gaining popularity in molding polymer micro/nano structures, it needs a breakthrough improvement in reducing cycle time before it can become a mass-production process. In this study, an embossing tool with a rapid heating and cooling capability was investigated to reduce the cycle time. During the process, the embossing tool was rapidly heated to above the polymer softening temperature (in less than a couple of seconds), pressed against a room-temperature polymer substrate, and subsequently rapidly cooled for mold separation. Different miniaturized features including microsquare and hexagonal wells, microcircular holes, and submicron surface features were successfully produced using the new process with a total embossing cycle time around 20 s. The fatigue test result indicated that the new embossing technology is durable and reliable for microscale feature replication.

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Cited By

Tsutsui AFushimi TMurakami TKojima RTanaka KOchiai Y(2024)HIFU Embossment of Acrylic SheetsProceedings of the 2024 CHI Conference on Human Factors in Computing Systems10.1145/3613904.3642890(1-23)Online publication date: 11-May-2024
https://dl.acm.org/doi/10.1145/3613904.3642890
Deshmukh SGoswami A(2022)Current innovations in roller embossing—a comprehensive reviewMicrosystem Technologies10.1007/s00542-022-05265-028:5(1077-1114)Online publication date: 1-May-2022
https://dl.acm.org/doi/10.1007/s00542-022-05265-0
Zhu JTian YYang CCui LWang FZhang DLiu X(2017)Low-cost and fast fabrication of the ultrasonic embossing on polyethylene terephthalate (PET) films using laser processed moldsMicrosystem Technologies10.1007/s00542-017-3369-x23:12(5653-5668)Online publication date: 1-Dec-2017
https://dl.acm.org/doi/10.1007/s00542-017-3369-x
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Information

Published In

cover image Microsystem Technologies

Microsystem Technologies Volume 12, Issue 8

July 2006

86 pages

ISSN:0946-7076

EISSN:1432-1858

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Copyright © Copyright © 2006 Springer-Verlag.

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Springer-Verlag

Berlin, Heidelberg

Publication History

Published: 01 July 2006

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Cited By

Tsutsui AFushimi TMurakami TKojima RTanaka KOchiai Y(2024)HIFU Embossment of Acrylic SheetsProceedings of the 2024 CHI Conference on Human Factors in Computing Systems10.1145/3613904.3642890(1-23)Online publication date: 11-May-2024
https://dl.acm.org/doi/10.1145/3613904.3642890
Deshmukh SGoswami A(2022)Current innovations in roller embossing—a comprehensive reviewMicrosystem Technologies10.1007/s00542-022-05265-028:5(1077-1114)Online publication date: 1-May-2022
https://dl.acm.org/doi/10.1007/s00542-022-05265-0
Zhu JTian YYang CCui LWang FZhang DLiu X(2017)Low-cost and fast fabrication of the ultrasonic embossing on polyethylene terephthalate (PET) films using laser processed moldsMicrosystem Technologies10.1007/s00542-017-3369-x23:12(5653-5668)Online publication date: 1-Dec-2017
https://dl.acm.org/doi/10.1007/s00542-017-3369-x
Mäkelä TKainlauri MWillberg-Keyriläinen PTammelin TForsström U(2016)Fabrication of micropillars on nanocellulose films using a roll-to-roll nanoimprinting methodMicroelectronic Engineering10.1016/j.mee.2016.05.023163:C(1-6)Online publication date: 1-Sep-2016
https://dl.acm.org/doi/10.1016/j.mee.2016.05.023
MäKelä THaatainen T(2012)Roll-to-roll pilot nanoimprinting process for backlight devicesMicroelectronic Engineering10.1016/j.mee.2012.03.03197(89-91)Online publication date: 1-Sep-2012
https://dl.acm.org/doi/10.1016/j.mee.2012.03.031
Seo YPark K(2012)Direct patterning of micro-features on a polymer substrate using ultrasonic vibrationMicrosystem Technologies10.1007/s00542-012-1524-y18:12(2053-2061)Online publication date: 1-Dec-2012
https://dl.acm.org/doi/10.1007/s00542-012-1524-y
Mäkelä THaatainen TAhopelto J(2011)Roll-to-roll printed gratings in cellulose acetate web using novel nanoimprinting deviceMicroelectronic Engineering10.1016/j.mee.2011.02.01688:8(2045-2047)Online publication date: 1-Aug-2011
https://dl.acm.org/doi/10.1016/j.mee.2011.02.016
Liu YShan X(2009)Study of mechanical response in micro-indentation of laminated ceramic green substratesMicrosystem Technologies10.5555/3111525.311181415:8(1311-1317)Online publication date: 1-Aug-2009
https://dl.acm.org/doi/10.5555/3111525.3111814
Shan XMaw HLing SLam Y(2009)Study on micro hot embossing of low temperature co-firable ceramic green substratesMicrosystem Technologies10.1007/s00542-008-0721-115:8(1225-1232)Online publication date: 1-Aug-2009
https://dl.acm.org/doi/10.1007/s00542-008-0721-1

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