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Glass frit bonding: an universal technology for wafer level encapsulation and packaging

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Microsystem Technologies, Volume 12, Issue 1-2

Pages 63 - 68

Published: 01 December 2005 Publication History

Abstract

This paper reports on glass frit wafer bonding, which is a universally usable technology for wafer level encapsulation and packaging. After explaining the principle and the process flow of glass frit bonding, experimental results are shown. Glass frit bonding technology enables bonding of surface materials commonly used in MEMS technology. It allows hermetic sealing and a high process yield. Metal lead throughs at the bond interface are possible, because of the planarizing glass interlayer. Examples of surface micromachined sensors demonstrate the potential of glass---frit bonding.

References

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HVG Fortbildungskurs (1995) Fügen von Glas. Verlag der Deutschen Glastechnischen Gesellschaft Frankfurt Main 1995 ISBN 3-921089-14-X

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Zinke A (1961) Technologie der Glasverschmelzungen. Technisch-physikalische Monographien Band 12, Leipzig 1996 Akademische Verlagsgesellschaft Geest und Portig K.-G

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Knechtel R, Heller J, Wiemer M, Frömel J (2003) "Silicon wafer bonding for encapsulating surface micromechanical systems using intermediate glass layers. In: Semiconductor wafer bonding VII, science, technology and applications, proceedings of the 203rd meeting ECS, Paris

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Knechtel R (2003) Wafer level encapsulation of surface micromechanical sensors demands and solution. In: Proceedings of the micro system technologies, München

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Cited By

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Pablos-Martín ATismer SNaumann FKrause MLorenz MGrundmann MHöche T(2016)Evaluation of the bond quality of laser-joined sapphire wafers using a fresnoite-glass sealantMicrosystem Technologies10.1007/s00542-015-2459-x22:1(207-214)Online publication date: 1-Jan-2016
https://dl.acm.org/doi/10.1007/s00542-015-2459-x
Brand STismer SMoe SSchjØlberg-Henriksen K(2015)Non-destructive wafer-level bond defect identification by scanning acoustic microscopyMicrosystem Technologies10.5555/2792903.279292621:7(1385-1394)Online publication date: 1-Jul-2015
https://dl.acm.org/doi/10.5555/2792903.2792926
Langa SDrabe CHerrmann ALudewig TRieck AFlemming AKaden C(2015)Wafer level vacuum packaging of micro-mirrors with buried signal linesMicrosystem Technologies10.1007/s00542-015-2433-721:5(1021-1028)Online publication date: 1-May-2015
https://dl.acm.org/doi/10.1007/s00542-015-2433-7
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Published In

Microsystem Technologies Volume 12, Issue 1-2

December 2005

185 pages

ISSN:0946-7076

EISSN:1432-1858

Issue’s Table of Contents

Publisher

Springer-Verlag

Berlin, Heidelberg

Publication History

Published: 01 December 2005

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Cited By

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Pablos-Martín ATismer SNaumann FKrause MLorenz MGrundmann MHöche T(2016)Evaluation of the bond quality of laser-joined sapphire wafers using a fresnoite-glass sealantMicrosystem Technologies10.1007/s00542-015-2459-x22:1(207-214)Online publication date: 1-Jan-2016
https://dl.acm.org/doi/10.1007/s00542-015-2459-x
Brand STismer SMoe SSchjØlberg-Henriksen K(2015)Non-destructive wafer-level bond defect identification by scanning acoustic microscopyMicrosystem Technologies10.5555/2792903.279292621:7(1385-1394)Online publication date: 1-Jul-2015
https://dl.acm.org/doi/10.5555/2792903.2792926
Langa SDrabe CHerrmann ALudewig TRieck AFlemming AKaden C(2015)Wafer level vacuum packaging of micro-mirrors with buried signal linesMicrosystem Technologies10.1007/s00542-015-2433-721:5(1021-1028)Online publication date: 1-May-2015
https://dl.acm.org/doi/10.1007/s00542-015-2433-7
Wu QSemenova YWang PFarrell G(2012)Numerical investigation on a laser based localised joining with a glass frit intermediate layerMicrosystem Technologies10.5555/3111523.311176618:1(87-95)Online publication date: 1-Jan-2012
https://dl.acm.org/doi/10.5555/3111523.3111766
Mohammadi ABennington CChiao M(2011)A hybrid capacitive pressure and temperature sensor fabricated by adhesive bonding technique for harsh environment of kraft pulp digestersMicrosystem Technologies10.5555/3112038.311234817:1(149-160)Online publication date: 1-Jan-2011
https://dl.acm.org/doi/10.5555/3112038.3112348

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