Damage Quantification with Embedded Piezoelectric Aggregates Based on Wavelet Packet Energy Analysis
<p>Decomposition tree of the wavelet packet analysis.</p> "> Figure 2
<p>The manufacturing process of the traditional piezoelectric aggregate (TPA): (<b>a</b>) the Lead Zirconate Titanate (PZT) patches; (<b>b</b>) the steel mold; (<b>c</b>) the configuration of the TPA; and (<b>d</b>) the finished TPA.</p> "> Figure 3
<p>The manufacturing process of the improved piezoelectric aggregate (IPA): (<b>a</b>) the Polymethyl Methacrylate (PMMA) tube; (<b>b</b>) the configuration of the IPA; and (<b>c</b>) the finished IPA.</p> "> Figure 4
<p>The pitch-catch mode to compare the signals of different piezoelectric aggregates.</p> "> Figure 5
<p>Signals acquired by different piezoelectric aggregates.</p> "> Figure 6
<p>Frequency responses of the IPA and the TPA.</p> "> Figure 7
<p>Configuration of the finite element model.</p> "> Figure 8
<p>Snapshots of the numerical model with the crack depth = 0 mm: (<b>a</b>) t = 0 ms; (<b>b</b>) t = 75 ms; (<b>c</b>) t = 150 ms; (<b>d</b>) t = 225 ms; and (<b>e</b>) t = 300 ms.</p> "> Figure 9
<p>Snapshots of the numerical model with the crack depth = 20 mm: (<b>a</b>) t = 0 ms; (<b>b</b>) t = 75 ms; (<b>c</b>) t = 150 ms; (<b>d</b>) t = 225 ms; and (<b>e</b>) t = 300 ms.</p> "> Figure 10
<p>Snapshots of the numerical model with the crack depth = 55 mm: (<b>a</b>) t = 0 ms; (<b>b</b>) t = 75 ms; (<b>c</b>) t = 150 ms; (<b>d</b>) t = 225 ms; and (<b>e</b>) t = 300 ms.</p> "> Figure 10 Cont.
<p>Snapshots of the numerical model with the crack depth = 55 mm: (<b>a</b>) t = 0 ms; (<b>b</b>) t = 75 ms; (<b>c</b>) t = 150 ms; (<b>d</b>) t = 225 ms; and (<b>e</b>) t = 300 ms.</p> "> Figure 11
<p>Acquired signals from simulations with different crack depths: (<b>a</b>) crack depth = 0 mm (0%); (<b>b</b>) crack depth = 5 mm (5%); (<b>c</b>) crack depth = 10 mm (10%); (<b>d</b>) crack depth = 15 mm (15%); (<b>e</b>) crack depth = 20 mm (20%); (<b>f</b>) crack depth = 25 mm (25%); (<b>g</b>) crack depth = 30 mm (30%); (<b>h</b>) crack depth = 35 mm (35%); (<b>i</b>) crack depth = 40 mm (40%); (<b>j</b>) crack depth = 45 mm (45%); (<b>k</b>) crack depth = 50 mm (50%); and (<b>l</b>) crack depth = 55 mm (55%).</p> "> Figure 11 Cont.
<p>Acquired signals from simulations with different crack depths: (<b>a</b>) crack depth = 0 mm (0%); (<b>b</b>) crack depth = 5 mm (5%); (<b>c</b>) crack depth = 10 mm (10%); (<b>d</b>) crack depth = 15 mm (15%); (<b>e</b>) crack depth = 20 mm (20%); (<b>f</b>) crack depth = 25 mm (25%); (<b>g</b>) crack depth = 30 mm (30%); (<b>h</b>) crack depth = 35 mm (35%); (<b>i</b>) crack depth = 40 mm (40%); (<b>j</b>) crack depth = 45 mm (45%); (<b>k</b>) crack depth = 50 mm (50%); and (<b>l</b>) crack depth = 55 mm (55%).</p> "> Figure 12
<p>Linearity of the WPEI with respect to the crack depth (numerical investigation).</p> "> Figure 13
<p>Setup of the testing equipment.</p> "> Figure 14
<p>The specimens of the cement beams with different crack depths: (<b>a</b>) crack depth = 0 mm; (<b>b</b>) crack depth = 20 mm; and (<b>c</b>) crack depth = 55 mm.</p> "> Figure 15
<p>The acquired signals from the experiments with different crack depths: (<b>a</b>) crack depth = 0 mm (0%); (<b>b</b>) crack depth = 5 mm (5%); (<b>c</b>) crack depth = 10 mm (10%); (<b>d</b>) crack depth = 15 mm (15%); (<b>e</b>) crack depth = 20 mm (20%); (<b>f</b>) crack depth = 25 mm (25%); (<b>g</b>) crack depth = 30 mm (30%); (<b>h</b>) crack depth = 35 mm (35%); (<b>i</b>) crack depth = 40 mm (40%); (<b>j</b>) crack depth = 45 mm (45%); (<b>k</b>) crack depth = 50 mm (50%); and (<b>l</b>) crack depth = 55 mm (55%).</p> "> Figure 15 Cont.
<p>The acquired signals from the experiments with different crack depths: (<b>a</b>) crack depth = 0 mm (0%); (<b>b</b>) crack depth = 5 mm (5%); (<b>c</b>) crack depth = 10 mm (10%); (<b>d</b>) crack depth = 15 mm (15%); (<b>e</b>) crack depth = 20 mm (20%); (<b>f</b>) crack depth = 25 mm (25%); (<b>g</b>) crack depth = 30 mm (30%); (<b>h</b>) crack depth = 35 mm (35%); (<b>i</b>) crack depth = 40 mm (40%); (<b>j</b>) crack depth = 45 mm (45%); (<b>k</b>) crack depth = 50 mm (50%); and (<b>l</b>) crack depth = 55 mm (55%).</p> "> Figure 16
<p>Linearity of the WPEI with respect to the crack depth (experimental investigation).</p> ">
Abstract
:1. Introduction
2. Method of Damage Quantification
2.1. Elastic Waves in Cement Beams
2.2. The Wavelet Packet-Based Energy Analysis
3. Improved Piezoelectric Aggregate
3.1. Preparation of the TPA
3.2. Preparation of the IPA
3.3. Comparison between the IPA and the TPA
4. Numerical Investigation
4.1. Expilict Finite Element Analysis
4.2. Numerical Modelling
4.3. Damage Quantification Based on the Simulated Data
5. Experimental Investigation
5.1. Experimental Setup
5.2. Damage Quantification Based on the Measured Data
6. Conclusions and Path Forward
6.1. Conclusions
- The IPA sealed by the epoxy resin has better electric insulation than that of the TPA sealed by the cement. The new sealing process can effectively alleviate the cross talk in the acquired signal and facilitate the signal interpretation and damage quantification.
- The wavelet packet analysis is a reliable method to extract the elastic wave energy. The damage quantification index proposed in this paper is able to provide a linear characterization of the crack depth at the mid-span of the cement beam. According to the linear expression from the linear regression, the crack depth can be estimated by referring to the damage quantification index (WPEI).
- The embedment of the IPA can fulfill a global structural health monitoring for cement-based structures. Due to the good strength, high electric resistance, and compatible deformation, the IPAs can be built inside the structure and can characterize the structural state in real time.
6.2. Path Forward
- The piezoelectric aggregates require wires to provide power to excite the elastic waves, causing wiring issues. Self-powered or wireless powered piezoelectric aggregates can highly promote the application of the piezoelectric aggregates.
- The deformation of the piezoelectric aggregates can excite elastic waves in all directions. The diverging propagation of the elastic wave may cause energy loss and multiple reflections at the structural boundary, obstructing the interpretation of the acquired signals. A directional transducer, which can focus waves in a particular direction, is desirable to enhance the detection range.
Author Contributions
Funding
Conflicts of Interest
References
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w/c Ratio | Curing Period | Curing Temperature | Curing Moisture |
0.36 | 28 days | 20 ± 2 °C | 97 ± 2% |
Density | Poisson Ratio | Elastic Modulus | Electric Resistance |
2350 kg/m3 | 0.2 | 3.25 × 1010 Pa | 6.00 × 109 Ω·m |
Size (mm) | TPA | IPA | Piezoelectric Ceramic |
---|---|---|---|
Inner diameter | 20 | 20 | 14 |
Height | 20 | 20 | 1 |
Density | Poisson Ratio | Elastic Modulus | Electric Resistance |
---|---|---|---|
1200 kg/m3 | 0.38 | 2.00 × 109 Pa | 1.60 × 1014 Ω·m |
Residual Sum of Squares | Adjusted R-Square | Intercept (Standard Error) | Slope (Standard Error) |
---|---|---|---|
1.6693 × 10−18 | 0.9522 | 1.0124 × 10−8 (2.2186 × 10−10) | −1.0142 × 10−10 (6.8333 × 10−12) |
Residual Sum of Squares | Adjusted R-Square | Intercept (Standard Error) | Slope (Standard Error) |
---|---|---|---|
9.3882 × 10−4 | 0.9733 | 0.4529 (0.0053) | −0.0033 (1.6205 × 10−4) |
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Wang, Z.; Wei, L.; Cao, M. Damage Quantification with Embedded Piezoelectric Aggregates Based on Wavelet Packet Energy Analysis. Sensors 2019, 19, 425. https://doi.org/10.3390/s19020425
Wang Z, Wei L, Cao M. Damage Quantification with Embedded Piezoelectric Aggregates Based on Wavelet Packet Energy Analysis. Sensors. 2019; 19(2):425. https://doi.org/10.3390/s19020425
Chicago/Turabian StyleWang, Zijian, Li Wei, and Maosen Cao. 2019. "Damage Quantification with Embedded Piezoelectric Aggregates Based on Wavelet Packet Energy Analysis" Sensors 19, no. 2: 425. https://doi.org/10.3390/s19020425