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TCG: a transitive closure graph-based representation for non-slicing floorplans

Published: 22 June 2001 Publication History

Abstract

In this paper, we propose a transitive closure graph-based representation for general floorplans, called TCG, and show its superior properties. TCG combines the advantages of popular representations such as sequence pair, BSG, and B*-tree. Like sequence pair and BSG, but unlike O-tree, B*-tree, and CBL, TCG is P-admissible. Like B*-tree, but unlike sequence pair, BSG, O-tree, and CBL, TCG does not need to construct additional constraint graphs for the cost evaluation during packing, implying faster runtime. Further, TCG supports incremental update during operations and keeps the information of boundary modules as well as the shapes and the relative positions of modules in the representation. More importantly, the geometric relation among modules is transparent not only to the TCG representation but also to its operations, facilitating the convergence to a desired solution. All these properties make TCG an effective and flexible representation for handling the general floorplan/placement design problems with various constraints. Experimental results show the promise of TCG.

References

[1]
Y.-C. Chang, Y.-W. Chang, G.-M. Wu, and S.-W. Wu, "B*-trees: A new representation for non-slicing floorplans," Proc. DAC, pp. 458-463, June 2000.
[2]
P.-N. Guo, C.-K. Cheng, and T. Yoshimura, "An O-Tree representation of nonslicing floorplan and its applications,"Proc. DAC, pp. 268-273, June 1999.
[3]
X. Hong, G. Huang, Y. Cai, J. Gu, S. Dong, C.-K. Cheng, and J. Gu, "Corner Block List: An effective and efficient topological representation of nonslicing floorplan," Proc. ICCAD, pp. 8-12, Nov. 2000.
[4]
S. Kirkpatrick, C. D. Gelatt, and M. P. Vecchi, "Optimization by simulated annealing," Science, vol. 220, no. 4598, pp.671-680, May, 1983.
[5]
E. Lawler, Combinatorial Optimization: Networks and Matroids, Holt, Rinehart, and Winston, 1976.
[6]
H. Murata, K. Fujiyoshi, S. Nakatake, and Y. Kajitani, "Rectangle-packingbased module placement," Proc. ICCAD, pp. 472-479, Nov. 1995.
[7]
S. Nakatake, K. Fujiyoshi, H. Murata, and Y. Kajitani, "Module placement on BSG-structure and IC layout applications," Proc. ICCAD, pp. 484-491, Nov. 1996.
[8]
T. Ohtsuki, N. Suzigama, and H. Hawanishi, "An optimization technique for intergrated circuit layout design," Proc. ICCST, Kyoto, pp. 67-68, 1970.
[9]
H. Onodera, Y. Taniquchi, and K. Tamaru, "Branch-and-bound placement for building block layout," Proc. DAC, pp. 433-439, 1991.
[10]
R.H.J.M. Otten, "Automatic floorplan design,"Proc. DAC, pp.261-267, June 1982.
[11]
P. Pan and C.-L. Liu, "Area minimization for floorplans," IEEE TCAD, pp. 123- 132, Jan. 1995.
[12]
Y.-Pang, C.-K. Cheng, and T. Yoshimura, "An enhanced perturbingalgorithm for floorplan design using the O-tree representation," Proc. ISPD, pp. 168-173, April 2000.
[13]
S. M. Sait and H. Youssef, VLSI Physical Design Automation, IEEE Press, 1995.
[14]
X. Tang and D. F. Wong, " FAST-SP: A fast algorithm for block placement based on sequence pair," Proc. ASP-DAC, pp. 521-526, Jan. 2001.
[15]
T.-C. Wang, and D. F. Wong, "An optimal algorithm for floorplan and area optimization," Proc. DAC, pp.180-186, June 1990.
[16]
D. F. Wong, and C.-L. Liu, "A new algorithm for floorplan design,c Proc. DAC, pp. 101-107, June 1986.

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cover image ACM Conferences
DAC '01: Proceedings of the 38th annual Design Automation Conference
June 2001
863 pages
ISBN:1581132972
DOI:10.1145/378239
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Published: 22 June 2001

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  • (2024)Design and Development of Serial Driver Verification and Test Module using Universal Verification Methodology2024 4th International Conference on Pervasive Computing and Social Networking (ICPCSN)10.1109/ICPCSN62568.2024.00126(754-757)Online publication date: 3-May-2024
  • (2024)Automatic Placement of PCB Functional Modules Based on Regional Division2024 13th International Conference on Communications, Circuits and Systems (ICCCAS)10.1109/ICCCAS62034.2024.10652680(51-58)Online publication date: 10-May-2024
  • (2023)P* Admissible Thermal-Aware Matrix Floorplanner for 3D ICs2023 IEEE 36th International System-on-Chip Conference (SOCC)10.1109/SOCC58585.2023.10256905(1-6)Online publication date: 5-Sep-2023
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