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Variations on a Hexagon: Iterative Design of Interactive Cyberphysical Tokens and Constraints

Published: 11 February 2024 Publication History

Abstract

We describe iterations on the design of a hexagonal token and constraint tangible and cyberphysical interface. Our system has been co-designed both for use in tangible, embedded, embodied interaction and extended reality classroom contexts, and within broader applied generalizations. We survey some of the related literature in hexagonal, rectangular, and triangular tangible interfaces. We express a design space characterizing several aspects of these prior systems; and apply these to a number of additional virtual and physical iterations. We accompany our text with 3D printable, circuit board, and virtual models for a number of these interactors, usable in both tangible and purely virtual forms, including versions engaging four different embedded computing platforms (Raspberry Pi Zero, Raspberry Pi Pico, Adafruit Circuit Playground, and Blinks). We discuss experiences from use of these in classroom settings, and steps toward broader applications.

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  • (2024)Generative AI syntheses of platform, content, visuals, and kinetics for cyberphysical computationally-mediated posters and broader applicationsCompanion Proceedings of the 29th International Conference on Intelligent User Interfaces10.1145/3640544.3645225(45-49)Online publication date: 18-Mar-2024

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    cover image ACM Conferences
    TEI '24: Proceedings of the Eighteenth International Conference on Tangible, Embedded, and Embodied Interaction
    February 2024
    1058 pages
    ISBN:9798400704024
    DOI:10.1145/3623509
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    Published: 11 February 2024

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    1. core tangibles
    2. cyberphysical interfaces
    3. tangible interfaces

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    • (2024)Generative AI syntheses of platform, content, visuals, and kinetics for cyberphysical computationally-mediated posters and broader applicationsCompanion Proceedings of the 29th International Conference on Intelligent User Interfaces10.1145/3640544.3645225(45-49)Online publication date: 18-Mar-2024

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