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Web Studies 4: WS.4 Conference Report

Published: 20 February 2024 Publication History

Abstract

WS.4, the Fourth International Conference on Web Studies, was held in Mexico City, from October 30 to 31, 2023. WS is a multidisciplinary conference organized in cooperation with ACM SIGWEB since 2018. It unites scholars, artists, and professionals who consider the web as their object of inquiry.

References

[1]
Hagino, M., Miura, H., Kimura, N., and Watanuki, K. 2015. Driver's recognition of head-up display (hud) as information provision system. In SIGGRAPH Asia 2015 Head-Up Displays and Their Applications. SA '15. Association for Computing Machinery, New York, NY, USA.
[2]
Reyes, E., Bernstein, M., and Ruffo, G., Eds. 2018. WS.2 2018: Proceedings of the 2nd International Conference on Web Studies. Association for Computing Machinery, New York, NY, USA.
[3]
Reyes, E., Bernstein, M., Ruffo, G., and Saleh, I., Eds. 2020. WS.3 2020: Proceedings of the 3rd International Conference on Web Studies. Association for Computing Machinery, New York, NY, USA.
[4]
Wang, K., Wang, Z., and Perlin, K. 2023. Asymmetrical vr for education. In ACM SIGGRAPH 2023 Immersive Pavilion. SIGGRAPH '23. Association for Computing Machinery, New York, NY, USA.

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    Information & Contributors

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    Published In

    cover image ACM SIGWEB Newsletter
    ACM SIGWEB Newsletter  Volume 2024, Issue Winter
    Winter 2024
    33 pages
    EISSN:1931-1435
    DOI:10.1145/3643603
    Issue’s Table of Contents
    Permission to make digital or hard copies of part or all of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for third-party components of this work must be honored. For all other uses, contact the Owner/Author.

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    Association for Computing Machinery

    New York, NY, United States

    Publication History

    Published: 20 February 2024
    Published in SIGWEB Volume 2024, Issue Winter

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