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Research and Implementation of Defect Detection Algorithm for Chip Shell Based on VisionPro

Published: 13 April 2022 Publication History

Abstract

The dual-ball patch infrared receiver is a new type of infrared sensor chip. The front shell of the chip needs to be detected during the production process to achieve the purpose of eliminating defective products. This paper is based on VisionPro processing software to realize the defect detection of the chip. First, the front image of the chip taken by the industrial camera is quantized, filtered, and closed; then the PMAlign tool is used to extract the overall characteristics of the shell to determine whether the shell is missing; The FindCircle tool is used to find the left and right circles on the surface, and the FindCorner tool is used to find the left, right, up and down four right angles to judge whether the chip is partially defective or flipped; and finally output the judgment result. Experimental results show that the defect detection algorithm can successfully distinguish qualified products from defective products, and meet the requirements of industrial production.

References

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Li Benhong, Zhang Miao, Ou Xingfu. SOP Chip Pins Defect Detection Based on Machine Vision System Design[J]. Chinese Journal of Electron Devices,2017(1):171-178.
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Zhu Zhengtao,Li Bofeng, He Xiuyuan. Research on Inspecting the Defects of Circular Resistance Chip Based on Machine Vision[J]. Modular Machine Tool & Automatic Manufacturing Technique, 2015(5): 76-79.
[3]
Ye Tong. Research on Visual Positioning and Detection Technology of Multi-pin Chip Mount [M]. Hubei University of Technology, 2020.
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Fan Tianhai, Huang Danping, Tian Jianping. Research on pin height detection system based on machine vision components [J]. Optics, 2020(1):102-109.
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Xia Lian, Jia Weimiao, Cui Peng, Defects inspection and MATLAB realization of BGA chips based on machine vision[J]. Journal of Hefei University of Technology (Natural Science Edition), 2009(11): 32-38.
[6]
Zhu Gengming, Li Fangmin. Study of defect insection for IC based on computer vision[J]. Computer Engineering and Applications, 2015(9): 1866-1873.
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Zheng Jinju, Li Wenlong, Wang Yuhui, etc. QFP chip Visual inspection system and its inspection method[J]. China Mechanical Engineering, 2013(3):290-298.

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ICITEE '21: Proceedings of the 4th International Conference on Information Technologies and Electrical Engineering
October 2021
477 pages
ISBN:9781450386494
DOI:10.1145/3513142
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Association for Computing Machinery

New York, NY, United States

Publication History

Published: 13 April 2022

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Author Tags

  1. Defect detection
  2. Machine vision
  3. VisionPro

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  • Research-article
  • Research
  • Refereed limited

Funding Sources

  • Natural Science Foundation of Hunan Province
  • Natural Science Foundation of Hunan Province

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ICITEE2021

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