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A High-Precision Stochastic Solver for Steady-State Thermal Analysis with Fourier Heat Transfer Robin Boundary Conditions

Published: 22 December 2022 Publication History

Abstract

In this work, we propose a path integral random walk (PIRW) solver, the first accurate stochastic method for steady-state thermal analysis with mixed boundary conditions, especially involving Fourier heat transfer Robin boundary conditions. We innovatively adopt the strictly correct calculation of the local time and the Feynman-Kac functional êc (t) to handle Neumann and Robin boundary conditions with high precision. Compared with ANSYS, experimental results show that PIRW achieves over 121× speedup and over 83× storage space reduction with a negligible error within 0.8° C at a single point. An application combining PIRW with low-accuracy ANSYS for the temperature calculation at hot-spots is provided as a more accurate and faster solution than only ANSYS used.

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            cover image ACM Conferences
            ICCAD '22: Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design
            October 2022
            1467 pages
            ISBN:9781450392174
            DOI:10.1145/3508352
            Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than the author(s) must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected].

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            Published: 22 December 2022

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            Author Tags

            1. feynman-kac functional
            2. local time
            3. poisson equation
            4. random walk method
            5. reflecting brownian motion
            6. robin boundary conditions
            7. thermal analysis

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            ICCAD '22
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            ICCAD '22: IEEE/ACM International Conference on Computer-Aided Design
            October 30 - November 3, 2022
            California, San Diego

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