Research on thermal simulation and cooling design of a shipboard cabinet
Authors: 
Song Liang, Mao Ding, Shiyu Cui, Liang WuAuthors Info & Claims
Pages 97 - 102
Abstract
Aiming at the problem that the temperature of display screen of a shipboard cabinet is higher than the limit demand, the thermal simulation software ICEPAK is used to carry out numerical analysis of the internal temperature field of the cabinet and the modified heat dissipation design of the air-cooled channel. The numerical results show that the cooling channel design of the original cabinet is effective for the heat dissipation of the internal heat source of the cabinet, but it can't meet the heat dissipation requirements of the display panel. Through the design of the modified cooling channel of the original cabinet, it is found that the modified cooling channel not only reduce the temperature of the internal heat source of the cabinet but also effectively reduce the maximum temperature of the display panel by about 25℃. The numerical results have important guiding significance for the safe operation design of the shipboard cabinet.
References
[1]
Zuo Xiaogang, Cui Guomin, Wang Jinyang Research on thermal design of control cabinet based on orthogonal test [J] Electronic Science and technology, 2016, 29 (5): 19-22.
[2]
Ni Ming, Hou Shihong Verification of strength and heat dissipation performance of open forced air cooling cabinet [J] Ship electronic countermeasure, 2020, 43 (3): 102-106.
[3]
Tan Guihong, Li Xiaofeng, Hong Daliang, Lin Quan. General structure design of large broadband fixed electronic system [J]. Radar science and technology, 2021,19 (5): 565-570.
[4]
Wang C C, Yang K S, Liu Y P, Effect of cannelure fin configuration on compact aircooling heat sink[J]. Applied Thermal Engineering, 2011, 31(10):1640-1647.
[5]
Elnaggar M, Abdullah M Z, Mujeebu M A. Experimental analysis and FEM simulation of finned U-shape multi heat pipe for desktop PC cooling[J]. Energy Conversion and Management, 2011, 52( 8–9):2937-2944.
[6]
Zeghari K, Louahlia-Gualous H, Ternet F, Experimental study of flat heat pipe for cooling TV Boxes[C] 2018 IEEE International Telecommunications Energy Conference. IEEE, 2018.
Index Terms
- Research on thermal simulation and cooling design of a shipboard cabinet
Index terms have been assigned to the content through auto-classification.
Recommendations
Hybrid 3D-IC Cooling System Using Micro-fluidic Cooling and Thermal TSVs
ISVLSI '12: Proceedings of the 2012 IEEE Computer Society Annual Symposium on VLSI3D-ICs bring about new challenges to chip thermal management due to their high heat densities. Micro-channel based liquid cooling and thermal through-silicon-vias (TSVs) have been adopted to alleviate the thermal issues in 3D-ICs. Thermal TSV (which ...
Thermal modeling and design on smartphones with heat pipe cooling technique
ICCAD '17: Proceedings of the 36th International Conference on Computer-Aided DesignWhile the performance of smartphones becomes much higher, the application processor consumes considerable power. Thus, it is hard to meet thermal constraints by using conventional cooling techniques. Fortunately, since heat pipes can efficiently ...
Indoor Temperature Fluctuation and Cooling Load Reduction Using Thermal Mass and Night Ventilation
CDCIEM '11: Proceedings of the 2011 International Conference on Computer Distributed Control and Intelligent Environmental MonitoringThe paper presents a qualitative effect of external thermal mass, night ventilation flow on cooling load reduction and indoor air temperature fluctuation at nighttime using thermal mass and night ventilation. A simple residential building model with air-...
Comments
Please enable JavaScript to view thecomments powered by Disqus.Information & Contributors
Information
Published In
October 2022
753 pages
ISBN:9781450397780
DOI:10.1145/3569966
Copyright © 2022 ACM.
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]
Publisher
Association for Computing Machinery
New York, NY, United States
Publication History
Published: 20 December 2022
Check for updates
Qualifiers
- Research-article
- Research
- Refereed limited
Conference
CSSE 2022
CSSE 2022: 2022 5th International Conference on Computer Science and Software Engineering
October 21 - 23, 2022
Guilin, China
Acceptance Rates
Overall Acceptance Rate 33 of 74 submissions, 45%
Contributors
Other Metrics
Bibliometrics & Citations
Bibliometrics
Article Metrics
- 0Total Citations
- 17Total Downloads
- Downloads (Last 12 months)3
- Downloads (Last 6 weeks)0
Reflects downloads up to 16 Nov 2024
Other Metrics
Citations
View Options
Login options
Check if you have access through your login credentials or your institution to get full access on this article.
Sign inFull Access
View options
View or Download as a PDF file.
PDFeReader
View online with eReader.
eReaderHTML Format
View this article in HTML Format.
HTML Format