Nothing Special   »   [go: up one dir, main page]

skip to main content
10.1145/343647.343844acmconferencesArticle/Chapter ViewAbstractPublication PagesdateConference Proceedingsconference-collections
Article
Free access

Assessing the cost effectiveness of integrated passives

Published: 01 January 2000 Publication History
First page of PDF

References

[1]
Esprit Project 20492: Silicon Substrate Multi Chip Modules For Innovative Products. http://www.ife.ee.ethz.ch/mcm/summit/.
[2]
H. Bleiweiss and E. Roelants. The Innovative SIMOV Technology. Future Circuits International, 4:153-159, 1998.
[3]
J. Hartung. High Q Inductors for MCM-Si Technology. In Proc. Int. Conf. on Multi-Chip Modules and High-Density Packages MCM' 98, Denver CO, USA, pages 256-261, 1998.
[4]
T. Lenihan, L. Schaper, Y. Shi, G. Morcan, and K. Fairchild. Embedded Thin-Film Resistors, Capacitors, and Inductors in Flexible Polyimide Films. In Proc. Int. Electronics Packaging Symp. IEPS' 96, Austin TX, USA, pages 192-202, 1996.
[5]
C.-M. Lin, E. Logan, and D. Tuckerman. Precision Embedded Thin-Film Resistors for Multichip Modules (MCM-D). In Proc. IEEE Conf. on Multichip Modules MCMC' 97, Santa Cruz CA, USA, pages 44-49, 1997.
[6]
H. Pohjonen and E. Kuisma. Future Challenges for Passive Components in Wireless Communications Products. In Proc. Wireless Communications Conf. WCC' 96, Boulder CO, USA, pages 31-32, 1996.
[7]
C. Power, M. Realff, and S. Bhattacharya. A Decision Tool for Design of Manufacturing Systems for Integrated Passive Substrates. In Proc. IMAPS ATW Integrated Passives, Denver CO, USA, 1999.
[8]
M. Scheffler, D. Ammann, A. Thiel, C. Habiger, and G. Tr6ster. Modeling and Optimizing the Cost of Electronic Systems. IEEE Design + Test of Computers, 15(3):20-26, 1998.

Recommendations

Comments

Please enable JavaScript to view thecomments powered by Disqus.

Information & Contributors

Information

Published In

cover image ACM Conferences
DATE '00: Proceedings of the conference on Design, automation and test in Europe
January 2000
707 pages
ISBN:1581132441
DOI:10.1145/343647
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

Sponsors

  • EDAA: European Design Automation Association
  • ECSI
  • EDAC: Electronic Design Automation Consortium
  • SIGDA: ACM Special Interest Group on Design Automation
  • IEEE-CS: Computer Society
  • IFIP: International Federation for Information Processing
  • The Russian Academy of Sciences: The Russian Academy of Sciences

Publisher

Association for Computing Machinery

New York, NY, United States

Publication History

Published: 01 January 2000

Permissions

Request permissions for this article.

Check for updates

Qualifiers

  • Article

Conference

DATE00
Sponsor:
  • EDAA
  • EDAC
  • SIGDA
  • IEEE-CS
  • IFIP
  • The Russian Academy of Sciences
DATE00: Design Automation and Test in Europe
March 27 - 30, 2000
Paris, France

Acceptance Rates

Overall Acceptance Rate 518 of 1,794 submissions, 29%

Upcoming Conference

DATE '25
Design, Automation and Test in Europe
March 31 - April 2, 2025
Lyon , France

Contributors

Other Metrics

Bibliometrics & Citations

Bibliometrics

Article Metrics

  • 0
    Total Citations
  • 174
    Total Downloads
  • Downloads (Last 12 months)22
  • Downloads (Last 6 weeks)4
Reflects downloads up to 16 Nov 2024

Other Metrics

Citations

View Options

View options

PDF

View or Download as a PDF file.

PDF

eReader

View online with eReader.

eReader

Login options

Media

Figures

Other

Tables

Share

Share

Share this Publication link

Share on social media