research-article

UltraPower: Powering Tangible & Wearable Devices with Focused Ultrasound

Authors:

Rafael Morales González,

Orestis GeorgiouAuthors Info & Claims

TEI '21: Proceedings of the Fifteenth International Conference on Tangible, Embedded, and Embodied Interaction

Article No.: 1, Pages 1 - 13

https://doi.org/10.1145/3430524.3440620

Published: 14 February 2021 Publication History

Abstract

Wireless power transfer creates new opportunities for interaction with tangible and wearable devices, by freeing designers from the constraints of an integrated power source. We explore the use of focused ultrasound as a means of transferring power to a distal device, transforming passive props into dynamic active objects. We analyse the ability to transfer power from an ultrasound array commonly used for mid-air haptic feedback and investigate the practical challenges of ultrasonic power transfer (e.g., receiving and rectifying energy from sound waves). We also explore the ability to power electronic components and multimodal actuators such as lights, speakers and motors. Finally, we describe exemplar wearable and tangible device prototypes that are activated by UltraPower, illustrating the potential applications of this novel technology.

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Index Terms

UltraPower: Powering Tangible & Wearable Devices with Focused Ultrasound
1. Human-centered computing
  1. Human computer interaction (HCI)
    1. Interaction devices
      1. Haptic devices

Index terms have been assigned to the content through auto-classification.

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Published In

cover image ACM Other conferences

TEI '21: Proceedings of the Fifteenth International Conference on Tangible, Embedded, and Embodied Interaction

February 2021

908 pages

ISBN:9781450382137

DOI:10.1145/3430524

Editor:
Raphael Wimmer
University of Regensburg, Germany
,
General Chairs:
Martin Kaltenbrunner
University of Art and Design Linz, Austria
,
Martin Murer
University of Salzburg, Austria
,
Program Chairs:
Katrin Wolf
Beuth University of Applied Sciences, Berlin, Germany
,
Ian Oakley
UNIST, Ulsan, Republic of Korea

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Association for Computing Machinery

New York, NY, United States

Publication History

Published: 14 February 2021

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Research-article
Research
Refereed limited

Funding Sources

European Union?s Horizon 2020 research and innovation programme
Government of Navarre (FEDER)
Marie Sk?odowska-Curie project NEWSENs

Conference

TEI '21

TEI '21: Fifteenth International Conference on Tangible, Embedded, and Embodied Interaction

February 14 - 17, 2021

Salzburg, Austria

Acceptance Rates

TEI '21 Paper Acceptance Rate 40 of 136 submissions, 29%;

Overall Acceptance Rate 393 of 1,367 submissions, 29%

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Cited By

Child OHanton OKellett CSutton MDrinkwater BFraser MCiolfi LHogan TDöring TJenkins Tvan Dijk JHuron SLi ZCoyle DSigner B(2024)Tangible Explorations of SonolithographyProceedings of the Eighteenth International Conference on Tangible, Embedded, and Embodied Interaction10.1145/3623509.3633387(1-14)Online publication date: 11-Feb-2024
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Yang XSayono JXu JZhang Y(2024)Interaction-Power Stations: Turning Environments into Ubiquitous Power Stations for Charging WearablesExtended Abstracts of the CHI Conference on Human Factors in Computing Systems10.1145/3613905.3650769(1-8)Online publication date: 11-May-2024
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Song KTung SKim APaulos E(2024)Füpop: "Real Food" Flavor Delivery via Focused UltrasoundProceedings of the 2024 CHI Conference on Human Factors in Computing Systems10.1145/3613904.3642709(1-14)Online publication date: 11-May-2024
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Morisaki TKamigaki TFujiwara MMakino YShinoda H(2024)UltLever: Ultrasound-Driven Passive Haptic Actuator Based on Amplifying Radiation Force Using a Simple Lever MechanismIEEE Transactions on Haptics10.1109/TOH.2024.336376417:3(471-482)Online publication date: Jul-2024
https://doi.org/10.1109/TOH.2024.3363764
Song KPaulos E(2023)Vim: Customizable, Decomposable Electrical Energy StorageProceedings of the 2023 CHI Conference on Human Factors in Computing Systems10.1145/3544548.3581110(1-18)Online publication date: 19-Apr-2023
https://dl.acm.org/doi/10.1145/3544548.3581110
Allevato GFrey THaugwitz CRutsch MHinrichs JMuller RPesavento MKupnik M(2022)Calibration of Air-Coupled Ultrasonic Phased Arrays. Is it worth it?2022 IEEE International Ultrasonics Symposium (IUS)10.1109/IUS54386.2022.9957576(1-4)Online publication date: 10-Oct-2022
https://doi.org/10.1109/IUS54386.2022.9957576
Marzo A(2022)Prototyping Airborne Ultrasonic ArraysUltrasound Mid-Air Haptics for Touchless Interfaces10.1007/978-3-031-04043-6_15(335-346)Online publication date: 17-Sep-2022
https://doi.org/10.1007/978-3-031-04043-6_15
Morales REzcurdia IIrisarri JAndrade MMarzo A(2021)Generating Airborne Ultrasonic Amplitude Patterns Using an Open Hardware Phased ArrayApplied Sciences10.3390/app1107298111:7(2981)Online publication date: 26-Mar-2021
https://doi.org/10.3390/app11072981
Freeman E(2021)Enhancing Ultrasound Haptics with Parametric Audio EffectsProceedings of the 2021 International Conference on Multimodal Interaction10.1145/3462244.3479951(692-696)Online publication date: 18-Oct-2021
https://dl.acm.org/doi/10.1145/3462244.3479951

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