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Senselet: Distributed Sensing Infrastructure for Improving Process Control and Safety in Academic Cleanroom Environments

Published: 29 September 2020 Publication History

Abstract

Semiconductor cleanrooms are used to fabricate devices with feature sizes that can be much smaller than a dust particle. Hence, any environmental deviations in temperature, or humidity around fabrication instruments may become the root cause of hundreds of transistors failing during the manufacturing. Furthermore, researchers work with dangerous chemicals in cleanrooms and violation of safety may lead to disastrous consequences. Therefore, we have developed an affordable, locally-controlled distributed sensing infrastructure, called SENSELET, for academic cleanrooms. It provides highly effective services for environment sensing around scientific instruments, sensory data collection and visualization, indoor localization, and instrument proximity detection for safety of researchers.

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Cited By

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  • (2024)Micro-forming process for miniaturized industrial products: influencing factors, progress and challengesInternational Journal of Metallic Materials10.1080/2996136X.2024.24084741:1(53-62)Online publication date: 7-Oct-2024
  • (2023)A review on micro-forming technologies: characteristics and trends for their industrial applicationProcedia CIRP10.1016/j.procir.2023.06.148118(863-866)Online publication date: 2023
  • (2021)SENSELET++: A Low-cost Internet of Things Sensing Platform for Academic Cleanrooms2021 IEEE 18th International Conference on Mobile Ad Hoc and Smart Systems (MASS)10.1109/MASS52906.2021.00020(90-98)Online publication date: Oct-2021

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Information

Published In

cover image GetMobile: Mobile Computing and Communications
GetMobile: Mobile Computing and Communications  Volume 24, Issue 2
June 2020
34 pages
ISSN:2375-0529
EISSN:2375-0537
DOI:10.1145/3427384
Issue’s Table of Contents
Permission to make digital or hard copies of part or all of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for third-party components of this work must be honored. For all other uses, contact the Owner/Author.

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Association for Computing Machinery

New York, NY, United States

Publication History

Published: 29 September 2020
Published in SIGMOBILE-GETMOBILE Volume 24, Issue 2

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Cited By

View all
  • (2024)Micro-forming process for miniaturized industrial products: influencing factors, progress and challengesInternational Journal of Metallic Materials10.1080/2996136X.2024.24084741:1(53-62)Online publication date: 7-Oct-2024
  • (2023)A review on micro-forming technologies: characteristics and trends for their industrial applicationProcedia CIRP10.1016/j.procir.2023.06.148118(863-866)Online publication date: 2023
  • (2021)SENSELET++: A Low-cost Internet of Things Sensing Platform for Academic Cleanrooms2021 IEEE 18th International Conference on Mobile Ad Hoc and Smart Systems (MASS)10.1109/MASS52906.2021.00020(90-98)Online publication date: Oct-2021

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