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Flexible chip placement via reinforcement learning: late breaking results

Published: 23 August 2022 Publication History

Abstract

Recently, successful applications of reinforcement learning to chip placement have emerged. Pretrained models are necessary to improve efficiency and effectiveness. Currently, the weights of objective metrics (e.g., wirelength, congestion, and timing) are fixed during pretraining. However, fixed-weighed models cannot generate the diversity of placements required for engineers to accommodate changing requirements as they arise. This paper proposes flexible multiple-objective reinforcement learning (MORL) to support objective functions with inference-time variable weights using just a single pretrained model. Our macro placement results show that MORL can generate the Pareto frontier of multiple objectives effectively.

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Cited By

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  • (2024)Unleashing the Potential of AQFP Logic Placement via Entanglement Entropy and ProjectionProceedings of the 61st ACM/IEEE Design Automation Conference10.1145/3649329.3658467(1-6)Online publication date: 23-Jun-2024
  • (2024)Challenges in Floorplanning and Macro Placement for Modern SoCsProceedings of the 2024 International Symposium on Physical Design10.1145/3626184.3639695(71-72)Online publication date: 12-Mar-2024
  • (2024)AI-Driven Innovations in IC Designs: From Planning to Implementation2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)10.1109/VLSITSA60681.2024.10546365(1-2)Online publication date: 22-Apr-2024
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cover image ACM Conferences
DAC '22: Proceedings of the 59th ACM/IEEE Design Automation Conference
July 2022
1462 pages
ISBN:9781450391429
DOI:10.1145/3489517
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than the author(s) must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected].

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Published: 23 August 2022

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DAC '22: 59th ACM/IEEE Design Automation Conference
July 10 - 14, 2022
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Overall Acceptance Rate 1,770 of 5,499 submissions, 32%

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Cited By

View all
  • (2024)Unleashing the Potential of AQFP Logic Placement via Entanglement Entropy and ProjectionProceedings of the 61st ACM/IEEE Design Automation Conference10.1145/3649329.3658467(1-6)Online publication date: 23-Jun-2024
  • (2024)Challenges in Floorplanning and Macro Placement for Modern SoCsProceedings of the 2024 International Symposium on Physical Design10.1145/3626184.3639695(71-72)Online publication date: 12-Mar-2024
  • (2024)AI-Driven Innovations in IC Designs: From Planning to Implementation2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)10.1109/VLSITSA60681.2024.10546365(1-2)Online publication date: 22-Apr-2024
  • (2024)Reinforcement-Learning-Based Foggy-Aware Optimal Placement Method for Analog and MixedSignal Circuits2024 IEEE International Symposium on Circuits and Systems (ISCAS)10.1109/ISCAS58744.2024.10558520(1-5)Online publication date: 19-May-2024
  • (2024)Addendum: A graph placement methodology for fast chip designNature10.1038/s41586-024-08032-5634:8034(E10-E11)Online publication date: 26-Sep-2024

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