The Research of Low Temperature Sintering Nano-sliver Paste Based on Anand Model
Authors: 
Jihui Wu, Hui Yang, Yang ZhangAuthors Info & Claims
Pages 105 - 108
Abstract
Considering of the advantages of low temperature sintering of nano-silver paste, compared with other lead-free solders, low temperature sintering of nano-silver paste has been applied in chip packaging. Someone conducted in-depth research on the tensile behavior of nano-silver paste of low temperature sintering and test on the Dynamic Mechanical Analyzer (DMA), some of the sintered sliver films under different temperature decrease with increasing temperature or with decreasing strain rate. In this study, Anand viscoplastic constitutive model was adopted, and ANSYS software was used to simulate the hot cycle load of the chip and the conjunctiva of nano-silver paste. The simulation results show that the plastic strain accumulation occurred in the nano-silver paste bond layer during the temperature cyclic loading process, which is the main reason that may cause the failure of chip connection.
References
[1]
Fu Bing, Reliability Analysis of Inverted Solder Joint, master of engineering dissertation of Harbin Institute of Technology
[2]
Dun-ji Yu. Xu Chen, Gang Chen, ect. Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment. J
[3]
Brown S B, Kim K H, Anand L. An internal variable constitutive model for hot working of metals J. International Journal of Plasticity, 1989, 5(3):95--130.
[4]
Zhang li, Chen Xu, NOSE H, et al. Anand Model Predicted the Stress-strain Behavior of 63Sn37Pb Solder. Mechanical strength, 2004, 26(4): 447--450.
[5]
Zhang Liang, Han Jiguang, Guo Yonghuan, etc. Sn Ag Cu - nano Al solder Anand Constitutive Relation and Solder Joint Reliability. J. journal of university of electronic science and technology
[6]
Liu tao, Yang Fengpeng, editor-in-chief, proficient in ANSYS M, Beijing: Tsinghua university press, September 2002, 218--249.
[7]
Pan Tsung-Yu. Thermal cycling induced plastic deformation in solder joints: accumulated deformation in SMT solder joints J.IEEE Transactions on Components, Hybrids and Manufacturing Technology, 1999, 14(4):224--232
[8]
Shahreen Kasim, Eniasharmila Karunakaran, Nurul Aswa Omar, Norfaradilla Wahid, Hanayanti Hafit, Ayu Al yani (2017). Pdk Fire Fighting Management System. Acta Electronica Malaysia, 1(2): 23--25.
[9]
Biqing Li, Zhao Li (2018). The Implement of Wireless Responder System Based on Radio Frequency Technology. Acta Electronica Malaysia, 2(1) 15--17.
[10]
Chin Pei Yuan, Norfaradilla Wahid, Shahreen Kasim, Mohd Farhan Md Fudzee, Azizul Azhar Ramli, Hairulnizam Mahdin, Seah Choon Sen (2017). UTHM Student Planner. Acta Informatica Malaysia, 1(1): 17--21.
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- The Research of Low Temperature Sintering Nano-sliver Paste Based on Anand Model
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Published In
December 2018
365 pages
ISBN:9781450365703
DOI:10.1145/3305275
Copyright © 2018 ACM.
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In-Cooperation
- International Engineering and Technology Institute, Hong Kong: International Engineering and Technology Institute, Hong Kong
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Association for Computing Machinery
New York, NY, United States
Publication History
Published: 29 December 2018
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- Short-paper
- Research
- Refereed limited
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ISBDAI '18
ISBDAI '18: International Symposium on Big Data and Artificial Intelligence
December 29 - 30, 2018
Hong Kong, Hong Kong
Acceptance Rates
ISBDAI '18 Paper Acceptance Rate 70 of 340 submissions, 21%;
Overall Acceptance Rate 70 of 340 submissions, 21%
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