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3D-IC: New Perspectives for a Digital Pixel Sensor

Published: 12 September 2016 Publication History

Abstract

Digital Pixel Sensors (DPS) are often unsuitable in the standard market due to large pixel size and low Fill-Factor (FF) in spite of several advantages like an early conversion. Nevertheless, the digital pixel represents presages of the "smart" pixel integrating maximum of processing in pixel level. It's for this reason that a special attention should be paid in this one. An elegant solution to compensate for the disadvantages of the DPS is to use an emergent three-dimension integration technology. So in this paper, an explanation of the sensitivity of image sensor is done highlighting the role of the fill-factor on this characteristic. Then a description of a particular digital pixel is described as well as a brief overview of different three-dimension integration methods. The digital pixel includes a photodiode, a Delta-Sigma Modulation (DSM) and a digital decimation filter. Finally, this paper presents an approach which combines a 3D technology, the CMOS (Complementary Metal Oxide Semi-conductor) 130nm 3D-IC FaStack Tezzaron technology, and the Multi-Channel-Bit-Serial (MCBS) method allowing the presented pixel to obtain a high fill-factor about 80% and a pixel pitch of 32.5μm.

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  • (2017)High Dynamic Range Spectral Imaging Pipeline For Multispectral Filter Array CamerasSensors10.3390/s1706128117:6(1281)Online publication date: 3-Jun-2017
  • (2017)HDR Imaging Pipeline for Spectral Filter Array CamerasImage Analysis10.1007/978-3-319-59129-2_34(401-412)Online publication date: 19-May-2017
  1. 3D-IC: New Perspectives for a Digital Pixel Sensor

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    ICDSC '16: Proceedings of the 10th International Conference on Distributed Smart Camera
    September 2016
    242 pages
    ISBN:9781450347860
    DOI:10.1145/2967413
    Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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    Publication History

    Published: 12 September 2016

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    Author Tags

    1. 3D-IC
    2. CMOS 130nm FaStack Tezzaron
    3. Digital Pixel Sensor
    4. Fill-Factor
    5. Image sensor sensitivity
    6. Multi-Channel-Bit-Serial

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    View all
    • (2017)High Dynamic Range Spectral Imaging Pipeline For Multispectral Filter Array CamerasSensors10.3390/s1706128117:6(1281)Online publication date: 3-Jun-2017
    • (2017)HDR Imaging Pipeline for Spectral Filter Array CamerasImage Analysis10.1007/978-3-319-59129-2_34(401-412)Online publication date: 19-May-2017

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