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A case for leveraging 802.11p for direct phone-to-phone communications

Published: 11 August 2014 Publication History

Abstract

WiFi cannot effectively handle the demands of device-to-device communication between phones, due to insufficient range and poor reliability. We make the case for using IEEE 802.11p DSRC instead, which has been adopted for vehicle-to-vehicle communications, providing lower latency and longer range. We demonstrate a prototype motivated by a novel fabrication process that deposits both III-V and CMOS devices on the same die. In our system prototype, the designed RF front-end is interfaced with a baseband processor on an FPGA, connected to Android phones. It consumes 0.02uJ/bit across 100m assuming free space. Application-level power control dramatically reduces power consumption by 47-56%.

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        cover image ACM Conferences
        ISLPED '14: Proceedings of the 2014 international symposium on Low power electronics and design
        August 2014
        398 pages
        ISBN:9781450329750
        DOI:10.1145/2627369
        Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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        Publication History

        Published: 11 August 2014

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        Author Tags

        1. cmos
        2. gan
        3. ieee 802.11p
        4. lees process
        5. phone-to-phone communication
        6. wifi

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        ISLPED '14 Paper Acceptance Rate 63 of 184 submissions, 34%;
        Overall Acceptance Rate 398 of 1,159 submissions, 34%

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        Cited By

        View all
        • (2022)Design of 20-28 GHz GaAs Phase Shifter MMIC and Small Signal Validation using MVS-GaAs Model2022 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)10.1109/BCICTS53451.2022.10051736(187-190)Online publication date: 16-Oct-2022
        • (2021)Enabling Monolithic Heterogeneously Integrated Si/III-V Technology Platform2021 IEEE 14th International Conference on ASIC (ASICON)10.1109/ASICON52560.2021.9620293(1-4)Online publication date: 26-Oct-2021
        • (2020)Car-to-Pedestrian communication with MEC-support for adaptive safety of Vulnerable Road UsersComputer Communications10.1016/j.comcom.2019.10.033150:C(83-93)Online publication date: 15-Jan-2020
        • (2019)Adaptive Safety Context Information for Vulnerable Road Users with MEC Support2019 15th Annual Conference on Wireless On-demand Network Systems and Services (WONS)10.23919/WONS.2019.8795475(28-35)Online publication date: Jan-2019
        • (2019)Towards Millimeter-Wave Phased Array Circuits and Systems For Small Form Factor and Power Efficient 5G Mobile Devices2019 IEEE International Symposium on Phased Array System & Technology (PAST)10.1109/PAST43306.2019.9021005(1-5)Online publication date: Oct-2019
        • (2019)MACH-2K Architecture: Building Mobile Device Trust and Utility for Emergency Response Networks2019 IEEE 16th International Conference on Mobile Ad Hoc and Sensor Systems Workshops (MASSW)10.1109/MASSW.2019.00037(152-157)Online publication date: Nov-2019
        • (2019)Implementation of InGaAs-OI Passive Devices and Its Application to 5G Millimeter-Wave Phase Shifter2019 IEEE BiCMOS and Compound semiconductor Integrated Circuits and Technology Symposium (BCICTS)10.1109/BCICTS45179.2019.8972758(1-4)Online publication date: Nov-2019
        • (2017)Linearity Enhancement of a Fully Integrated 6-GHz GaN Power AmplifierIEEE Microwave and Wireless Components Letters10.1109/LMWC.2017.274667327:10(927-929)Online publication date: Oct-2017
        • (2017)GaN device-circuit interaction on RF linear power amplifier designed using the MVSG compact model2017 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)10.1109/CSICS.2017.8240430(1-4)Online publication date: Oct-2017
        • (2016)Automotive V2X on phonesProceedings of the 2016 Conference on Design, Automation & Test in Europe10.5555/2971808.2972007(858-863)Online publication date: 14-Mar-2016
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